Probe card including contactors formed projection portion
A probe card includes a base wiring layer, a rewiring layer, and a contactor. The base wiring layer has a non-contactor area and a contactor area that projects to a higher level than the non-contactor area. The rewiring layer is formed on a surface of the base wiring layer so that the contactor area is higher than the non-contactor area. The contactor is provided on a surface of the rewiring layer in a contactor area thereof.
1. A probe card comprising:
a base wiring layer having a contactor area, a noncotnactor area on a surface thereof and via holes and wherein the contactor area projects higher than the non-contactor area;
a rewiring layer disposed on the surface of the base wiring layer, the rewiring layer having via holes and a contactor area higher than the non-contactor area utilizing the height of the projecting contactor area in the base wiring layer, and pitch of the via holes of the rewiring layer being smaller than pitch of the via holes of the base wiring layer; and
a contactor disposed on the surface in the contactor area of the rewiring layer, the contactor formed on the surface of the rewiring layer at the contactor area to correspond to the via holes of the rewiring layer that are formed with the pitch that is smaller than the pitch of the via holes of the base wiring layer.
2. The probe card according to claim 1 , further comprising:
a resin wiring layer disposed on the surface of the contactor area of the rewiring layer and disposed between the rewiring layer and the contactor.
3. The probe card according to claim 1 , wherein a rewiring board constituting the rewiring layer comprises a resin having a flatness greater than the flatness of the base wiring layer.
4. The probe card according to claim 1 , wherein a wiring board constituting the base wiring layer comprises a ceramic.
5. A probe card comprising: a base wiring layer having a contactor area and a non-contactor area on a surface thereof, wherein the contactor area projects higher than the non-contactor area;
a rewiring layer disposed on the surface of the base wiring layer, the rewiring layer having a contactor area higher than the non-contactor area utilizing the height of the projecting contactor area in the base wiring layer;
a contactor disposed on the surface in the contactor area of the rewiring layer; and
a resin wiring layer disposed on the surface of the contactor area of the rewiring layer and disposed between the rewiring layer and the contactor,
wherein a resin board constituting the resin wiring layer has a smooth surface formed of a cured liquid resin on the surface of the rewiring layer.
6. The probe card according to claim 5 , wherein a rewiring board constituting the rewiring layer comprises a resin having a flatness greater than the flatness of the base wiring layer.
7. The probe card according to claim 5 , wherein a wiring board constituting the base wiring layer comprises a ceramic.
8. A probe card comprising
a base wiring layer having a contactor area and a non-contactor area on a surface thereof;
a rewiring layer disposed on the surface of the base wiring layer:
a resin wiring layer disposed only on the surface of the contactor area of the rewiring layer, wherein the contactor area of the resin wiring layer is higher than the non-contactor area of the rewiring layer; and
a plurality of electrically independent contactor disposed on a surface of the resin wiring layer,
wherein a resin board constituting the resin wiring layer has a smooth surface formed of a cured liquid resin on the surface of the rewiring layer.
9. The probe card according to claim 8 , wherein a rewiring board constituting the rewiring layer comprises a resin having a flatness greater than the flatness of the base wiring layer.
10. The probe card according to claim 8 , wherein a wiring board constituting the base wiring layer comprises a ceramic.