IP Library Granted Patent US 8,413,509
Granted Patent B2
US 8,413,509 · App. 12/102,601 · Granted Apr 9, 2013

Spring member for use in a microelectromechanical systems sensor

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Quick Facts
Patent No.
US 8,413,509
App. No.
12/102,601
Granted
Apr 9, 2013
Kind
B2
Abstract

A device ( 96 ) includes a microelectromechanical (MEMS) sensor ( 40 ). The sensor ( 40 ) includes a movable element ( 42 ) adapted for motion in a direction ( 44 ) and an anchor ( 46 ) coupled to a substrate ( 48 ). The MEMS sensor ( 40 ) further includes spring members ( 50 ) interconnected between the movable element ( 42 ) and the anchor ( 46 ). Each of the spring members ( 50 ) includes beams ( 56, 58, 60 ) arranged in substantially parallel alignment, with the beam ( 60 ) positioned between the other beams ( 56, 58 ). Each of the beams ( 56, 58 ) is coupled to the anchor ( 46 ) and the beam ( 60 ) is coupled to the movable element ( 42 ). Each of the spring members ( 50 ) further includes a support structure ( 64 ) joined with the beams ( 56, 58 ) to provide vertical stiffness to the beams ( 56, 58 ) of the spring member ( 50 ).

Claims (42)

1. A device comprising:

a microelectromechanical systems (MEMS) sensor, said sensor comprising:

a movable element adapted for motion in a first direction;

an anchor coupled to a substrate; and

spring members interconnected between said movable element and said anchor, each of said spring members comprising:

a first beam;

a second beam, each of said first and second beams being coupled to one of said anchor and said movable element, said each of said first and second beams including a pair of elongated side walls;

a third beam positioned between said first and second beams and coupled to another of said anchor and said movable element, said first, second, and third beams being arranged in substantially parallel alignment; and

a support structure having a first leg, a second leg, and a span member coupled between corresponding ends of said first and second legs, said first and second legs being located proximate opposing longitudinal sides of said third beam, wherein said first leg is positioned between said pair of side walls of said first beam, said first leg is cantilevered from a first end wall spanning between said pair of side walls of said first beam, said second leg is positioned between said pair of sidewalls of said second beam, and said second leg is cantilevered from a second end wall spanning between said pair of side walls of said second beam.

2. A device as claimed in claim 1 wherein each of said spring members is relatively flexible in said first direction and relatively stiff in a second direction.

3. A device as claimed in claim 1 wherein each of said first and second beams is a cantilever beam having a first end coupled to said one of said anchor and said movable element and a second end that is free.

4. A device as claimed in claim 1 wherein said each of said first and second beams exhibits a first dimensional design, and said third beam exhibits a second dimensional design that differs from said first dimensional design.

5. A device as claimed in claim 1 wherein said each of said first and second beams exhibits a first width and said third beam exhibits a second width, said second width being less than said first width.

6. A device as claimed in claim 1 wherein said span member is a free end of said support structure.

7. A device as claimed in claim 1 wherein said pair of elongated sidewalls of said each of said first and second beams comprises a first side wall and a second side wall spaced apart from said first side wall, said first side wall being attached to said one of said anchor and said movable element, and said second side wall of said each of said first and second beams being connected to one another and to said third beam.

8. A device as claimed in claim 7 wherein said each of said spring members comprises a reinforcing region, said second side walls of said first and second beams connect to one another via said reinforcing region, a first end of said third beam connects to said reinforcing region, and a second end of said third beam attaches to said another of said anchor and said movable element.

9. A device as claimed in claim 1 wherein said MEMS sensor comprises an accelerometer for detecting acceleration in said first direction, said movable element moving in response to said acceleration in said first direction.

10. A device as claimed in claim 9 wherein said accelerometer detects said acceleration of less than 10 g in said first direction.

11. A device as claimed in claim 1 wherein said spring members support said movable element disposed above and aligned substantially parallel to a plane of said substrate, and said first direction is substantially parallel to said substrate.

12. A microelectromechanical systems (MEMS) sensor, said sensor comprising:

a movable element adapted for motion in a first direction;

an anchor coupled to a substrate; and

spring members interconnected between said movable element and said anchor, each of said spring members comprising:

a first beam exhibiting a first width;

a second beam exhibiting said first width, each of said first and second beams being coupled to one of said anchor and said movable element, and said each of said first and second beams including a first side wall and a second side wall;

a third beam positioned between said first and second beams, said third beam exhibiting a second width that is less than said first width, said third beam coupled to another of said anchor and said movable element, said first, second, and third beams being arranged in substantially parallel alignment; and

a support structure having a first leg, a second leg, and a span member coupled between corresponding ends of said first and second legs, wherein said first leg is positioned between said first and second side walls of said first beam, said first leg is cantilevered from a first end wall spanning between said first and second side walls of said first beam, said second leg is positioned between said first and second side walls of said second beam, and said second leg is cantilevered from a second end wall spanning between said first and second side walls of said second beam.

13. A MEMS sensor as claimed in claim 12 wherein said each of said first and second beams is a cantilever beam having a first end coupled to said one of said anchor and said movable element and a second end that is free.

14. A MEMS sensor as claimed in claim 12 wherein said span member is a free end of said support structure.

15. A MEMS sensor as claimed in claim 12 wherein:

said first side wall of said each of said first and second beams is attached to said one of said anchor and said movable element;

said each of said spring members comprises a reinforcing region, said second side wall of said each of said first and second beams are connected to one another via said reinforcing region; and

said third beam includes a first end connected to said reinforcing region and a second end attached to said another of said anchor and said movable element.

16. A microelectromechanical systems (MEMS) sensor comprising:

a movable element adapted for motion in a first direction;

an anchor coupled to a substrate; and

spring members interconnected between said movable element and said anchor, each of said spring members comprising:

a first cantilever beam;

a second cantilever beam, each of said first and second cantilever beams having a first side wall and a second side wall spaced apart from said first side wall, said first side wall of said each of said first and second beams is coupled to one of said anchor and said movable element, each of said first and second beams having a free end, wherein said first beam includes a first end wall spanning between said first and second side walls of said first beam and said second beam includes a second end wall spanning between said first and second side walls of said second beam;

a third beam positioned between said first and second beams, said first, second, and third beams being arranged in substantially parallel alignment, and said third beam being coupled to another of said anchor and said movable element, said second side walls of said each of said first and second beams being connected to one another and to said third beam; and

a support structure having a first leg, a second leg, and a span member coupled between corresponding ends of said first and second legs, said first leg being positioned between said first and second side walls of said first beam and cantilevered from said first end wall, said second leg being positioned between said first and second of side walls of said second beam and cantilevered from said second end wall, and said span member is a free end of said support structure.

17. A MEMS sensor as claimed in claim 16 wherein said each of said spring members comprises a reinforcing region, said second side walls of said first and second beams connect to one another via said reinforcing region, a first end of said third beam connects to said reinforcing region, and a second end of said third beam attaches to said another of said anchor and said movable element.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
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SECURITY AGREEMENT Recorded Sep 24, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2008
From: GEISBERGER, AARON A.
To: FREESCALE SEMICONDUCTOR, INC.,
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