Wire guide roll for wire saw and method
View Patent ↗A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.
1. A wire guide roll for guiding a sawing wire in a wire saw for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece, the wire guide roll provided with a coating having a thickness of at least 2 mm and at most 7.5 mm, the coating comprising a coating material which has a Shore A hardness of at least 60 and at most 99, the coating furthermore containing a multiplicity of annular grooves adapted to guide the sawing wire in a direction perpendicular to a longitudinal axis of the wire guide roll, wherein the grooves each have a curved groove base and an aperture angle a of 60-130°, the wire guide roll suitable for guiding a multiplicity of wire segments which constitute a wire gang of the wire saw.
2. In a coated wire guide roll suitable for guiding a single sawing wire having a sawing wire diameter D in a wire saw and forming a wire gang capable of simultaneously slicing a multiplicity of wafers from a cylindrical semiconductor workpiece, the improvement comprising: providing the wire guide roll with a coating having a thickness of at least 2 mm and at most 7.5 mm, the coating comprising a coating material which has a Shore A hardness of at least 60 and at most 99, the coating furthermore containing a multiplicity of annular grooves adapted to guide the sawing wire having the sawing wire diameter D in a direction perpendicular to a longitudinal axis of the wire guide roll of the wire saw, wherein the grooves each have a curved groove base with a radius of curvature R which is 0.25-1.6 times the sawing wire diameter D, and an aperture angle a of 60-130°, the wire guide roll suitable for guiding a multiplicity of wire segments which constitute the wire gang of the wire saw.
3. The wire guide roll of claim 2 , wherein the coating of the wire guide roll consists of a material with a Shore A hardness of between 82 and 99.
4. The wire guide roll of claim 3 , wherein the radius of curvature R of the groove base is 0.4-0.9 times the sawing wire diameter D.
5. The wire guide roll of claim 4 , wherein the aperture angle of the grooves is 80-110°.
6. A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 5 and slicing said cylindrical workpiece by said wire saw.
7. The wire guide roll of claim 4 , wherein polyurethane is used as the coating material.
8. The wire guide roll of claim 3 , wherein the aperture angle of the grooves is 80-110°.
9. The wire guide roll of claim 3 , wherein polyurethane is used as the coating material.
10. A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 3 and slicing said cylindrical workpiece by said wire saw.
11. The wire guide roll of claim 2 , wherein the radius of curvature R of the groove base is 0.4-0.9 times the sawing wire diameter D.
12. The wire guide roll of claim 11 , wherein the aperture angle of the grooves is 80-110°.
13. The wire guide roll of claim 11 , wherein polyurethane is used as the coating material.
14. A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 11 and slicing said cylindrical workpiece by said wire saw.
15. The wire guide roll of claim 2 , wherein the aperture angle of the grooves is 80-110°.
16. The wire guide roll of claim 15 , wherein polyurethane is used as the coating material, and the coating material thickness is from 2 mm to 6 mm.
17. A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 15 and slicing said cylindrical workpiece by said wire saw.
18. The wire guide roll of claim 2 , wherein polyurethane is used as the coating material.
19. A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by sawing with a sawing wire of a diameter D in a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 2 and slicing said cylindrical workpiece by said wire saw.
20. The wire guide roll of claim 2 , wherein the multiplicity of annular grooves is such so as to accommodate about 300 turns of sawing wire.
21. The wire guide roll of claim 2 , wherein the cylindrical workpiece comprises a semiconductor single crystal.