Method for plating flexible printed circuit board

1. A method for plating an FPCB base board, comprising the steps of:

providing an FPCB base board comprising a sprocket region; and

placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board;

wherein a surface of the insulation shielding plate is an arc-shaped surface protruding from the insulation shielding plate to the sprocket region, whereby a distance between the surface of the insulation shielding plate and the sprocket region gradually reduces from two ends of the surface of the insulation shielding plate to a center/middle portion of the sprocket region along a width direction of the sprocket region, and a distance between the surface of an insulation shielding plate and a surface of the sprocket region is in a range from about 1 millimeter to about 50 millimeters; and

plating the FPCB base board.

2. The method as claimed in claim 1 , wherein the surface of the insulation shielding plate is flexible.

3. The method as claimed in claim 2 , wherein the insulation shielding plate is made of a material selected from a group consisting of polyimide, polyvinyl chloride and polypropylene.

4. The method as claimed in claim 1 , wherein both of the FPCB base board and the insulation shielding plate are arranged in a plating bath.

5. A method for plating an FPCB base board, comprising:

providing an FPCB base board comprising a sprocket region; and

placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board, wherein a surface of the insulation shielding plate, which faces the FPCB base board, is an arc-shaped surface protruding from the insulation shielding plate toward the sprocket region, and a minimal distance between the arc-shaped surface and the sprocket region is in a range from about 1 millimeter to about 50 millimeters; and

plating the FPCB base board.

6. The method as claimed in claim 5 , wherein the insulation shielding plate is flexible.

7. The method as claimed in claim 5 , wherein both of the FPCB base board and the insulation shielding plate are arranged in a tank, and an anode is disposed on an inner wall of the tank.

8. The method as claimed in claim 7 , wherein two holding components are arranged on two opposite inner walls of the tank to fix a supporting pole, and the supporting pole is connected with the insulation shielding plate.

9. A method for plating an FPCB base board, comprising:

providing an FPCB base board comprising a sprocket region; and

placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board, wherein a distance between an arc-shaped surface of the insulation shielding plate and a surface of the sprocket region gradually reduces from two ends of the arc-shaped surface of the insulation shielding plate to a central portion of the sprocket region along a width direction of the sprocket region, and a minimal distance between the arc-shaped surface of the insulation shielding plate and the surface of the sprocket region is in a range from about 1 millimeter to about 50 millimeters; and

plating the FPCB base board.

10. The method as claimed in claim 9 , wherein the insulation shielding plate is flexible.

11. The method as claimed in claim 9 , wherein both of the FPCB base board and the insulation shielding plate are arranged in a tank, and an anode is disposed on an inner wall of the tank.

12. The method as claimed in claim 11 , wherein two holding components are arranged on two opposite inner walls of the tank to fix a supporting pole, and the supporting pole is connected with the insulation shielding plate.