Thermal management for LED
View Patent ↗A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED.
1. An LED assembly comprising:
at least one LED device;
an interposer to which the LED device(s) are attached via a top of the LED device(s); and
a passivation layer formed on the top of the LED devices and wherein the LED devices are attached to the interposer by soldering the passivation layer of the LED devices to the interposer.
2. An LED assembly comprising:
at least one LED device;
an interposer to which the LED device(s) are attached via a top of the LED device(s); and
electrical contacts formed on sides of the LED devices and wherein the LED devices are attached to the interposer by soldering the electrical contacts of the LED devices to the interposer.
3. The LED assembly as recited in claim 1 , wherein the interposer comprises a metal-core interposer.
4. The LED assembly as recited in claim 1 , wherein the interposer comprises at least one opening formed therein, the openings receiving the LED device(s).
5. An LED assembly comprising:
at least one LED device; and
an interposer to which the LED device(s) are attached via a top of the LED device(s), wherein the interposer comprises at least one opening formed therein for receiving an LED device and further comprising at least one spring formed proximate the opening(s) for facilitating attachment of the LED device(s) to the interposer.
6. An LED assembly comprising:
at least one LED device; and
an interposer to which the LED device(s) are attached via a top of the LED device(s), wherein the interposer comprises at least one opening formed therein for receiving an LED device and further comprising at least one conductive spring formed proximate the opening(s) for facilitating attachment of the LED device(s) to the interposer and for facilitating electrical contact between the LED device(s) and the interposer.
7. The LED assembly as recited in claim 1 , wherein the LED device(s) are attached to the interposer, at least in part, by reflow soldering.
8. An LED assembly comprising:
a plurality of LED device(s); and
an interposer to which the LED device(s) are attached via a top of the LED device(s), wherein the plurality of LED device(s) are attached to the interposer via a top and sides of the LED devices.
9. An LED assembly comprising:
at least one LED device;
an interposer to which the LED device(s) are attached via a top of the LED device(s); and
a thermally conductive material attached to the top of the LED device(s) and wherein the LED device(s) are attached to the interposer via the thermally conductive material.
10. The LED assembly as recited in claim 9 , wherein the thermally conductive material comprises at least one of Si and SiC.
11. An LED device comprising a substrate and an active area, the substrate and the active area defining a top and two sides of the LED device, wherein the LED device is configured to attach to an interposer at the top and the sides of the LED device.
12. The LED device as recited in claim 11 , further comprising solder formed on the top and the two side of the LED device so as to facilitate reflow soldering of the LED device to an interposer.
13. An interposer comprising:
a thermally conductive substrate;
at least one opening formed in the substrate, the opening being configured to receive and attach at least one LED device; and
at least one spring configured to enhance attachment of the LED device to the interposer.