Patent Assignment
Reel/Frame 029281/0844
Security Agreement
Recorded: 2012-11-12
Pages: 24
Assignor
BRIDGELUX, INC.
Executed: 2012-11-09
Assignee
WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
88 KEARNY STREET, FOURTH FLOOR, SAN FRANCISCO, CALIFORNIA, 94108
Covered Properties
(226)
High Power Allngan Based Multi-Chip Light Emitting Diode
Patent:
6,869,812 →
Application:
10/438,108 →
Iii-Nitride Based on Semiconductor Device with Low-Resistance Ohmic Contacts
High Power Allngan Based Multi-Chip Light Emitting Diode
Light emitter with metal-oxide coating
Highly Reflective Mounting Arrangement for Leds
Patent:
7,622,746 →
Application:
11/378,763 →
Led Electrode
Electrode Structures for Leds with Increased Active Area
Surface Mountable Chip
Gan Based Led with Etched Exposed Surface for Improved Light Extraction Efficiency and Method for Making the Same
Slab Cross Flow Cvd Reactor
Gan Based Led Having Reduced Thickness and Method for Making the Same
Chemical Vapor Deposition Reactor Having Multiple Inlets
Led Structure
Light-Emitting Diode Chip With High Light Extraction And Method For Manufacturing The Same
Application:
12/039,563 →
Publication:
US 2009/0127575
Light-Emitting Chip Device with High Thermal Conductivity
Machined Cvd Shower Head
Light Emitting Devices with Constant Forward Voltage
Trenched Substrate for Crystal Growth and Wafer Bonding
Thermal Management for Led
Light Emitting Diodes with Smooth Surface for Reflective Electrode
Method and Apparatus for Generating White Light from Solid State Light Emitting Devices
Light Emitting Device Having Stacked Multiple Leds
LED with Reduced Electrode Area
Application:
12/147,242 →
Publication:
US 2009/0321775
Surface-Textured Encapsulations for Use with Light Emitting Diodes
Light Emitting Device Having a Transparent Thermally Conductive Layer
Light Emitting Device Having a Phosphor Layer
Methods and Apparatuses for Enhancing Heat Dissipation from a Light Emitting Device
Light Emitting Device Having a Refractory Phosphor Layer
Drilled Cvd Shower Head
Heat Sink Apparatus for Solid State Lights
Heat Sink Apparatus for Solid State Lights
Led Structure to Increase Brightness
Top Contact Led Thermal Management
Optical Platform to Enable Efficient Led Emission
Phosphor-Converted Led
Surface Mountable Chip
Multi-Layer Led Phosphors
Application:
12/208,077 →
Publication:
US 2010/0059771
Phosphor Layer Arrangement for Use with Light Emitting Diodes
Series Connected Segmented Led
Method and Apparatus for Generating Phosphor Film with Textured Surface
Inverted Led Structure with Improved Light Extraction
Fluid Pipe Heat Sink Apparatus for Solid State Lights
Wire Bonding to Connect Electrodes
Transparent Ring Led Assembly
Non-Global Solder Mask Led Assembly
Transparent Solder Mask Led Assembly
Multi-Cup Led Assembly
Efficient Led Array
Led Phosphor Deposition
Light Emitting Diode Luminaire
Light Emitting Diode Lamp
Performance and Color Consistent Led
Patent:
8,096,675 →
Application:
12/343,080 →
Method and Apparatus for Providing a Patterned Electrically Conductive and Optically Transparent or Semi-Transparent Layer Over a Lighting Semiconductor Device
Transparent Heat Spreader for Leds
Heat Sink Base for Leds
Light Sources Utilizing Segmented Leds to Compensate for Manufacturing Variations in the Light Output of Individual Segmented Leds
Light Emitting Diode Source with Protective Barrier
Substrate Based Light Source Package with Electrical Leads
Application:
12/428,389 →
Publication:
US 2010/0270580
Method and Apparatus for Manufacturing Led Devices Using Laser Scribing
Modular Led Light Bulb
Light-Emitting Device With Improved Electrode Structures
Thin-Film Led with P and N Contacts Electrically Isolated from the Substrate
Led Array Package Covered with a Highly Thermal Conductive Plate
Low Optical Loss Electrode Structures for Leds
Reconfigurable Led Array and Use in Lighting System
High Brightness Led Utilizing a Roughened Active Layer and Conformal Cladding
Solid State Lighting Device with an Integrated Fan
Application:
12/565,642 →
Publication:
US 2010/0276705
Light Emitter with Coating Layers
Application:
12/607,053 →
Publication:
US 2014/0124806
Highly Reflective Mounting Arrangement for Leds
Patent:
8,324,652 →
Application:
12/610,261 →
Light Emitting Diode with Thin Multilayer Phosphor Film
Application:
12/611,364 →
Publication:
US 2010/0276712
Surface Mountable Chip
LED with Improved Injection Efficiency
Method and System for Dynamic in-Situ Phosphor Mixing and Jetting
Light Source with Optics to Produce a Spherical Emission Pattern
Light Source Having Light Emitting Cells Arranged to Produce a Spherical Emission Pattern
Application:
12/645,284 →
Publication:
US 2010/0301356
Gan Based Led with Improved Light Extraction Efficiency and Method for Making the Same
Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
Application:
12/690,387 →
Publication:
US 2011/0062482
Top Contact Led Thermal Management
A Method for Cooling Light-Emitting Diode
Low Optical Loss Electrode Structures for Leds
Light-Emitting Diode Chip with High Light Extraction and Method for Manufacturing the Same
Thermal Management for Led
Surface-Textured Encapsulations for Use with Light Emitting Diodes
Efficient Led Array
Light Sources with Serially Connected Led Segments Including Current Blocking Diodes
Mounting Fixture for LED Lighting Modules
Application:
12/760,197 →
Publication:
US 2011/0069502
Phosphor Converted Light Source Having an Additional Led to Provide Long Wavelength Light
Sub-Assembly for a Light-Emitting Device Package and a Light Emitting Diode Package with Features Preventing Encapsulant Delamination
Method for Controlling Color Accuracy in a Light-Emitting Semiconductor-Based Device and Process for Producing a Light-Emitting Semiconductor-Based Device with Controlled Color Accuracy
Light Source Having a Refractive Element
Application:
12/766,710 →
Publication:
US 2010/0301728
Electrode Structures for Leds with Increased Active Area
Inverted Led Structure with Improved Light Extraction
Thin-Film Led with P and N Contacts Electrically Isolated from the Substrate
Application:
12/790,597 →
Publication:
US 2010/0314649
Spiral-path chimney-effect heat sink
Application:
12/807,272 →
Publication:
US 2012/0048511
Light Source Having Leds of Selected Spectral Output, and Method for Constructing Same
Phosphor Layer Arrangement for Use with Light Emitting Diodes
Light Emitting Diodes with Smooth Surface for Reflective Electrode
Thin-Film Led with P and N Contacts Electrically Isolated from the Substrate
Led Array Package with a Color Filter
Application:
12/836,140 →
Publication:
US 2012/0012864
Light Emitting Diode with Thin Multilayer Phosphor Film
Phosphor Layer Having Enhanced Thermal Conduction and Light Sources Utilizing the Phosphor Layer
Efficient Led Array
Drive Circuit for a Color Temperature Tunable Led Light Source
Phosphor Housing for Light Emitting Diode Lamp
Application:
12/856,170 →
Publication:
US 2011/0039471
Color Temperature Tunable Led Light Source
Application:
12/856,293 →
Publication:
US 2012/0038291
Gan Based Led Having Reduced Thickness and Method for Making the Same
Reflective Surface Sub-Assembly for a Light-Emitting Device
Method for Manufacturing a Reflective Surface Sub-Assembly for a Light-Emitting Device
Light-Emitting Device Array with Individual Cells
Light-Emitting Device Array with Individual Cells
Extended Source Light Module
Application:
12/879,817 →
Publication:
US 2011/0063846
Light-Emitting Device Mounting Fixture
Application:
12/881,092 →
Publication:
US 2011/0007515
Led Array Module and Led Array Module Frame
Application:
12/883,978 →
Publication:
US 2011/0063837
Light-Emitting Device with a Semi-Remote Phosphor Coating
Application:
12/886,349 →
Publication:
US 2011/0006331
Distributed Led-Based Light Source
Led-Based Replacement for Fluorescent Light Source
Led Light Source Utilizing Magnetic Attachment
Flexible Distributed Led-Based Light Source and Method for Making the Same
Low Optical Loss Electrode Structures for Leds
Leds with Low Optical Loss Electrode Structures
Methods of Low Loss Electrode Structures for Leds
Led Structure to Increase Brightness
Transparent Heat Spreader for Leds
Led Light Sources with Improved Thermal Compensation
Method and Apparatus for Generating Phosphor Film with Textured Surface
Surface-Textured Encapsulations for Use with Light Emitting Diodes
Method and Apparatus for Manufacturing Led Devices Using Laser Scribing
Shape Forming Heat Sink with Flexible Heat Rod
Optical Platform to Enable Efficient Led Emission
LED-Based Light Source Utilizing Asymmetric Conductors
Led Array Package Covered with a Highly Thermal Conductive Plate
Method and Apparatus for Generating White Light from Solid State Light Emitting Devices
System for Wafer-Level Phosphor Deposition
System for Wafer-Level Phosphor Deposition
Surface-Textured Encapsulations for Use with Light Emitting Diodes
Automatic Electrical Connection Assembly for Light Modules
System for Flash-Free Overmolding of Led Array Substrates
Surface-Textured Encapsulations for Use with Light Emitting Diodes
Cross Flow Cvd Reactor
Surface-Textured Encapsulations for Use with Light Emitting Diodes
Application:
12/978,874 →
Publication:
US 2011/0089457
Phosphor Layer Arrangement for Use with Light Emitting Diodes
Packaging Photon Building Blocks Having Only Top Side Connections in an Interconnect Structure
Light Emitting Diodes with Smooth Surface for Reflective Electrode
Method and Apparatus for Providing Omnidirectional Illumination Using Led Lighting
Series Connected Segmented Led
Reconfigurable Led Array and Use in Lighting System
Method for Fabricating a Light Source That Includes Phosphor-Converted Led
Modular Led Light Bulb
Reconfigurable Led Array and Use in Lighting System
Light Sources Utilizing Segmented Leds to Compensate for Manufacturing Variations in the Light Output of Individual Segmented Leds
Highly Efficient Led Array Module with Pre-Calculated Non-Circular Asymmetrical Light Distribution
Ac Led Light Source with Reduced Flicker
Led Light Source with Direct Ac Drive
Apparatus Providing Beamforming and Environmental Protection for LED Light Sources
Gimbaled Led Array Module
System for Providing a Directional LED Array
Application:
13/086,158 →
Publication:
US 2012/0147589
Side Light LED Troffer Tube
Led-Based Light Source Utilizing Asymmetric Conductors
Method and System for Dynamic in-Situ Phosphor Mixing and Jetting
LED Module with Integrated Thermal Spreader
Elongated Lenses for Use in Light Emitting Apparatuses
Application:
13/171,321 →
Publication:
US 2011/0254042
Laterally Contacted Blue Led with Superlattice Current Spreading Layer
Nucleation of Aluminum Nitride on a Silicon Substrate Using an Ammonia Preflow
Application:
13/190,420 →
Publication:
US 2013/0026480
Gradient Optics for Controllable Light Distribution for LED Light Sources
Boron-Containing Buffer Layer for Growing Gallium Nitride on Silicon
N-Type Gallium-Nitride Layer Having Multiple Conductive Intervening Layers
High Temperature Gold-Free Wafer Bonding for Light Emitting Diodes
Led Having a Low Defect N-Type Layer That Has Grown on a Silicon Substrate
Non-Reactive Barrier Metal for Eutectic Bonding Process
Led on Silicon Substrate Using Zinc-Sulfide as Buffer Layer
Application:
13/197,765 →
Publication:
US 2013/0032810
Distributed Current Blocking Structures for Light Emitting Diodes
Led Structure
GaN LEDs with Improved Area and Method for Making the Same
Buffer Layer for GaN-on-Si LED
Retrofittable Led Module with Heat Spreader
Driver-Free Light-Emitting Device
P-Type Doping Layers for Use with Light Emitting Devices
Light Emitting Regions for Use with Light Emitting Devices
Light Emitting Devices Having Dislocation Density Maintaining Buffer Layers
Application:
13/249,157 →
Publication:
US 2013/0082274
Light Emitting Devices Having Light Coupling Layers
Light Emitting Devices Having Light Coupling Layers with Recessed Electrodes
Reconfigurable Multi-Led Light Source
Light Emitting Diode Source with Protective Barrier
Application:
13/283,487 →
Publication:
US 2012/0153322
Jetting a Highly Reflective Layer Onto an Led Assembly
Optical Platform to Enable Efficient Led Emission
Light Modules Connectable Using Heat Pipes
Application:
13/290,945 →
Publication:
US 2012/0113641
Ac Led Array Module for Street Light Applications
Application:
13/290,970 →
Publication:
US 2012/0120655
Street Light Led
Application:
13/290,985 →
Publication:
US 2012/0106156
Thermal Heat Transfer Wire
Application:
13/291,005 →
Publication:
US 2012/0106136
Thermal Pipe Cap
Application:
13/291,765 →
Publication:
US 2012/0106137
Apparatus Providing Beamforming and Environmental Protection for Led Light Sources
Application:
13/291,825 →
Publication:
US 2012/0120664
Gradient Optics for Even Light Distribution of Led Light Sources
Series Connected Segmented Led
Method for Reducing Stress in Epitaxial Growth
Ac Led Array Module for Street Light Applications
Application:
13/294,155 →
Publication:
US 2012/0099321
Led Light Using Internal Reflector
Multi-Junction LED
Application:
13/294,984 →
Publication:
US 2012/0058584
Micro-Bead Blasting Process for Removing a Silicone Flash Layer
Efficient Led Array
White Led Assembly with Led String and Intermediate Node Substrate Terminals
Solid State Lighting Device with an Integrated Fan
Application:
13/339,308 →
Publication:
US 2012/0099314
Leds with Efficient Electrode Structures
Gold Micromask for Roughening to Promote Light Extraction in an Led
Phosphor Placement in White Light Emitting Diode Assemblies
Low Profile Heat Sink with Attached Led Light Source
Light Emitting Device Having a Transparent Thermally Conductive Layer
Application:
13/410,210 →
Publication:
US 2012/0153316
Packaging Photon Building Blocks Having Only Top Side Connections in a Molded Interconnect Structure
Method for manufacturing a light emitting diode with smooth surface for reflective electrode
Thin-Film Led with P and N Contacts Electrically Isolated from the Substrate
Distributed Bragg Reflector for Reflecting Light of Multiple Wavelengths from an Led
LED That Has Bounding Silicon-Doped Regions on Either Side of a Strain Release Layer
Patent:
8,669,585 →
Application:
13/602,145 →
Substrate Free Led Package
Verticle Fin Led Lamp Fixture
Patent:
592,799 →
Application:
29/320,462 →
Horizontal Fin Led Lamp Fixture
Patent:
595,011 →
Application:
29/320,463 →
Vertical Fin Led Lamp Fixture
Patent:
599,053 →
Application:
29/332,472 →
Gold Micromask for Roughening to Promote Light Extraction in an LED
Application:
61/529,868 →
Distributed Bragg Reflector for Reflecting Light of Multiple Wavelengths from an LED
Application:
61/530,385 →
Circuit Board for LED Applications
Application:
61/592,563 →
Circuit Board for LED Applications
Application:
61/594,341 →
Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure
Application:
61/594,371 →
Light Emitting Devices Having Shielded Silicon Substrates
Application:
61/622,710 →
Light Emitting Array Using External Reflector
Application:
61/624,221 →
LED Lens Design with More Uniform Color-Over-Angle Emission
Application:
61/641,219 →
Light Emitting Devices Having Shielded Silicon Substrates
Application:
61/661,982 →
Submount for LED Device Package
Application:
61/669,955 →
Light-Emitting Assemblies Comprising an Array of Light-Emmitting Diodes Having an Optimized Lens Configuration
Application:
61/710,629 →
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
May 9, 2012
From: ELITE OPTOELECTRONICS, INC.
To: BRIDGELUX, INC.
Reel/Frame 028184/0745 →
Assignment of Assignor's Interest
Jul 26, 2012
From: HELBING, RENE PETER
To: BRIDGELUX, INC.
Reel/Frame 028645/0408 →
Assignment of Assignor's Interest
Jul 1, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 030724/0395 →
Assignment of Assignor's Interest
Aug 16, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 031023/0681 →
Termination and Release of Security Interest in Patent Collateral Recorded at Reel/Frame 029281/0844 on November 12, 2012
Nov 4, 2013
From: WELLS FARGO BANK, NATIONAL ASSOCIATION (SUCCESSOR BY ASSIGNMENT FROM WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT)
To: BRIDGELUX, INC.
Reel/Frame 031560/0102 →
Assignment of Assignor's Interest
Jul 8, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033265/0062 →
Assignment of Assignor's Interest
Jul 28, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033400/0957 →
Assignment of Assignor's Interest
Aug 1, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033443/0908 →
Assignment of Assignor's Interest
Aug 14, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033540/0184 →
Assignment of Assignor's Interest
Aug 28, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033634/0410 →
Assignment of Assignor's Interest
Sep 22, 2014
From: TOSHIBA TECHNO CENTER INC.
To: MANUTIUS IP, INC.
Reel/Frame 033787/0733 →
Assignment of Assignor's Interest
Jun 24, 2015
From: LIU, HENG
To: BRIDGELUX INCORPORATED
Reel/Frame 035900/0958 →
Assignment of Assignor's Interest
Apr 20, 2016
From: MANUTIUS IP, INC.
To: TOSHIBA CORPORATION
Reel/Frame 038334/0444 →
Assignment of Assignor's Interest
Dec 1, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: ALPAD CORPORATION
Reel/Frame 044591/0755 →
Assignment of Assignor's Interest
Jun 14, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 046364/0164 →
Assignment of Assignor's Interest
Aug 30, 2018
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046986/0159 →
Change of Name
Sep 5, 2019
From: TOSHIBA TECHNO CENTER, INC.
To: TOSHIBA IPR SOLUTIONS, INC.
Reel/Frame 050278/0704 →
Assignment of Assignor's Interest
Sep 5, 2019
From: TOSHIBA IPR SOLUTIONS, INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 050278/0857 →
Assignment of Assignor's Interest
Jan 24, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051691/0442 →
Assignment of Assignor's Interest
Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →
Assignment of Assignor's Interest
Feb 18, 2022
From: BRIDGELUX, INC.
To: BX LED, LLC
Reel/Frame 059048/0101 →