Top contact LED thermal management
View Patent ↗An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs.
1. A method for fabricating a light emitting diode (LED) die, the method comprising:
providing a substrate;
forming a layer of n-type material upon the substrate;
forming a layer of p-type material upon the substrate, the p-type material cooperating with the n-type material to define an active region; and
forming a first extended, heat transmissive bond pad directly on the p-type material;
forming a second extended, heat transmissive bond pad directly on the substrate;
attaching the LED die to a lead frame via the first and second extended, heat transmissive bond pads, wherein the at least one extended, heat transmissive bond pad facilitates heat flow from an active region of the LED to the lead frame; and
attaching a heat transmissive substrate to the lead frame and the LED die.
2. The method as recited in claim 1 , wherein forming the first bond pad and the second bond pad comprises forming the first bond pad to a first height and the second bond pad to a second height such that a distance measured from a back surface of the substrate to a top surface of the first bond pad is approximately equal to a distance measured from the back surface of the substrate to a top surface of the second bond pad.
3. A method for fabricating a light emitting diode (LED) assembly, the method comprising:
providing at least one LED die;
forming at least one heat transmissive bond pad directly on an active area of the at least one die, the at least one heat transmissive bond pad being formed to extend beyond an area of the at least one die in at least one direction;
attaching a lead frame to the at least one die via the at least one heat transmissive bond pad, wherein the at least one heat transmissive bond pad facilitates heat flow from the at least one die to the lead frame;
attaching a heat transmissive substrate to the lead frame and the at least one die; and
wherein the at least one bond pad comprises a first bond pad formed directly on a substrate of the at least one die and a second bond pad is formed directly on a p-type material of the at least one die.
4. The method as recited in claim 3 , wherein the first bond pad has a first height and the second bond pad has a second height such that a distance measured from a back surface of the substrate to a top surface of the first bond pad is approximately equal to a distance measured from the back surface of the substrate to a top surface of the second bond pad.
5. The method as recited in claim 3 , wherein the heat transmissive substrate is configured to facilitate heat flow away from the at least one die.
6. The LED assembly as recited in claim 3 , further comprising soldering the heat transmissive substrate to the lead frame and the at least one via solder.