IP Library Granted Patent US 8,506,754
Granted Patent B2
US 8,506,754 · App. 12/978,842 · Granted Aug 13, 2013

Cross flow CVD reactor

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Quick Facts
Patent No.
US 8,506,754
App. No.
12/978,842
Granted
Aug 13, 2013
Kind
B2
Abstract

A cross flow chemical vapor deposition chamber can comprise an inlet duct having a generally rectangular cross-section and an outlet duct having a generally rectangular cross-section. The rectangular inlet duct and the rectangular outlet duct can facilitate laminar flow of reactant gases over a susceptor. Movable partitions can be configured to define a plurality of zones within the chamber. Each zone can contain a different reactant gas, concentration of reactant gas, and/or flow rate of reactant gas. Enhanced laminar flow can be provided, undesirable depletion of reactant gas can be mitigated, and enhanced control of reactant gases can be facilitated.

Claims (21)

1. A chemical vapor deposition reactor comprising:

a chamber;

a susceptor disposed within the chamber;

an inlet duct configured to provide gas to the chamber;

an outlet duct configured to exhaust gas from the chamber;

a lid configured to seal the chamber;

at least one movable partition configured to define a longitudinal row of individually controllable deposition zones within the chamber, wherein the deposition zones are configured to have different sizes in response to locations of the partitions; whereas at least one of the partitions is curved; and

wherein the inlet duct, the outlet duct, and the partition(s) are configured to facilitate laminar flow of gasses in one direction along the longitudinal row of zones and over the susceptor during vapor deposition.

2. The chemical vapor deposition reactor as recited in claim 1 , wherein the lid comprises a drilled shower head.

3. The chemical vapor deposition reactor as recited in claim 1 , wherein the lid comprises a drilled shower head and the zones receive reactant gas from the shower head, each zone being configured to receive a different reactant gas, concentration of reactant gas, and/or flow rate of reactant gas and wherein the reactant gas(es) of each zone do not substantially mix with one another.

4. The chemical vapor deposition reactor as recited in claim 1 , further comprising a plurality of slots within which the partition(s) is/are positionable.

5. The chemical vapor deposition reactor as recited in claim 1 , further comprising a plurality of slots within which the partition(s) is/are positionable, the slots being generally evenly spaced with respect to one another.

6. The chemical vapor deposition reactor as recited in claim 1 , further comprising a plurality of slots within which the partition(s) is/are positionable, the slots being unevenly spaced with respect to one another.

7. The chemical vapor deposition reactor as recited in claim 1 , further comprising a plurality of slots within which the partition(s) is/are positionable, wherein slots closer to the inlet duct are spaced closer to one another than slots farther from the inlet duct.

8. The chemical vapor deposition reactor as recited in claim 1 , further comprising two rails, the rails being generally parallel with respect to one another and having a plurality of slots formed therein such that ends of the partitions can be disposed within the slots and the partitions can be disposed between the rails.

9. The chemical vapor deposition reactor as recited in claim 1 , wherein partition(s) are generally rectangular partitions.

10. The chemical vapor deposition reactor as recited in claim 1 , wherein partition(s) are generally planar partitions.

11. The chemical vapor deposition reactor as recited in claim 1 , wherein partition(s) are non-planar partitions.

12. The chemical vapor deposition reactor as recited in claim 1 , wherein at least one of the partition(s) is a curved partition.

13. The chemical vapor deposition reactor as recited in claim 1 , wherein the inlet duct, the outlet duct, and the partition(s) are configured to facilitate laminar flow of gasses generally horizontally over the susceptor during vapor deposition.

14. The chemical vapor deposition reactor as recited in claim 1 , wherein at least one of the partition(s) is configured to have a curved shape able to configure a deposition zone with a curved boundary.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2014
From: MOSHTAGH, VAHID S.; LIU, HENG; RAMER, JEFFREY; SOLOMENSKY, MICHAEL
To: BRIDGELUX, INC.
Reel/Frame 033633/0285 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2014
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 033633/0306 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033633/0329 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 030724/0395 →
RELEASE OF SECURITY INTEREST Recorded May 22, 2013
From: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
To: BRIDGELUX, INC.
Reel/Frame 030466/0093 →
SECURITY AGREEMENT Recorded Nov 12, 2012
From: BRIDGELUX, INC.
To: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
Reel/Frame 029281/0844 →