System for flash-free overmolding of led array substrates

1. A method for molding encapsulations onto an LED array substrate, the method comprising:

attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate;

applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape;

pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape;

separating the molding surface from the substrate surface; and

removing the protective tape so that molding material flash is removed from the substrate leaving a molded substrate.

2. The method of claim 1 , wherein said attaching comprises attaching the protective tape so that electrical contacts on the substrate surface are protected from exposure to the molding material.

3. The method of claim 1 , further comprising dimensioning a width of the protective tape to be larger than a width of the substrate.

4. The method of claim 1 , further comprising applying a release material to the molding surface prior to applying the molding material.

5. The method of claim 1 , wherein said applying the molding material comprises applying the molding material to dies and wires exposed through the openings in the protective tape.

6. The method of claim 1 , further comprising degassing the molding material on the molding surface and the substrate.

7. The method of claim 1 , further comprising curing the molded substrate according to characteristics of the molding material.

8. The method of claim 1 , further comprising performing said attaching in a continuous process wherein a selected length of the protective tape is segmented into a plurality of protective tape portions that are attached to a plurality of LED array substrates, respectively.

9. The method of claim 1 , wherein the LED array substrate is configured to have at least one of a rigid portion and a flexible portion.

10. The method of claim 1 , wherein the substrate comprises at least one of a perforation, groove and gap to facilitate separation of the LED devices from the substrate, and said attaching comprises attaching the protective tape so that the at least one of the perforation, groove and gap are protected from exposure to the molding material.

11. The method of claim 1 , wherein the molding material comprises at least one of silicone and phosphor.

12. The method of claim 1 , wherein the protective tape comprises at least one of polyimide based tape and Teflon™ based tape.

13. An apparatus for molding encapsulations onto an LED array substrate, the apparatus comprising:

means for attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate;

means for applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the opening in the protective tape;

means for pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape;

means for separating the molding surface from the substrate surface; and

means for removing the protective tape so that molding material flash is removed from the substrate leaving a molded substrate.

14. The apparatus of claim 13 , wherein said means for attaching comprises means for attaching the protective tape so that electrical contacts on the substrate surface are protected from exposure to the molding material.

15. The apparatus of claim 13 , wherein said means for applying the molding material comprises means for applying the molding material to dies and wires exposed through the openings in the protective tape.

16. The apparatus of claim 13 , wherein said means for attaching comprises means for attaching the protective tape in a continuous process wherein a selected length of the protective tape is segmented into a plurality of protective tape portions that are attached to a plurality of LED array substrates, respectively.

17. The apparatus of claim 13 , wherein the LED array substrate is configured to have at least one of a rigid portion and a flexible portion.

18. The apparatus of claim 13 , wherein the substrate comprises at least one of a perforation, groove and gap to facilitate separation of the LED devices from the substrate, and said means for attaching comprises means for attaching the protective tape so that the at least one of the perforation, groove and gap are protected from exposure to the molding material.

19. The apparatus of claim 13 , wherein the molding material comprises at least one of silicone and phosphor.

20. An apparatus for molding encapsulations onto an LED array substrate, the apparatus comprising:

a masking tool configured to attach a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate;

a dispenser configure to apply molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape;

a molding press configured to press the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape;

a mold separator configured to separate the molding surface from the substrate surface; and

a removal device configured to remove the protective tape so that molding material flash is removed from the substrate leaving a molded substrate.

21. The apparatus of claim 20 , wherein said masking tool is configured to attach the protective tape so that electrical contacts on the substrate surface are protected from exposure to the molding material.

22. The apparatus of claim 20 , wherein said dispenser is configured to apply the molding material to dies and wires exposed through the openings in the protective tape.

23. The apparatus of claim 20 , further comprising a vacuum oven to degas the molding material on the molding tool and the substrate.

24. The apparatus of claim 20 , wherein said masking tool is configured to attach the protective tape in a continuous process wherein a selected length of the protective tape is segmented into a plurality of protective tape portions that are attached to a plurality of LED array substrates, respectively.

25. The apparatus of claim 20 , wherein the LED array substrate is configured to have at least one of a rigid portion and a flexible portion.

26. The apparatus of claim 20 , wherein the substrate comprises at least one of a perforation, groove and gap to facilitate separation of the LED devices from the substrate, and said attaching comprises attaching the protective tape so that the at least one of the perforation, groove and gap are protected from exposure to the molding material.

27. The apparatus of claim 20 , wherein the molding material comprises at least one of silicone and phosphor.

28. The apparatus of claim 20 , wherein the protective tape comprises at least one of polyimide based tape and Teflon™ based tape.