Patent Assignment
Reel/Frame 033443/0908
Assignment of Assignor's Interest
Recorded: 2014-08-01
Pages: 7
Assignor
TOSHIBA TECHNO CENTER INC.
Executed: 2014-05-16
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Properties
(20)
Light-Emitting Chip Device with High Thermal Conductivity
Light Emitting Devices with Constant Forward Voltage
Trenched Substrate for Crystal Growth and Wafer Bonding
Light Emitting Device Having Stacked Multiple Leds
Wire Bonding to Connect Electrodes
Method and Apparatus for Providing a Patterned Electrically Conductive and Optically Transparent or Semi-Transparent Layer Over a Lighting Semiconductor Device
Light-Emitting Diode Chip with High Light Extraction and Method for Manufacturing the Same
Light Sources with Serially Connected Led Segments Including Current Blocking Diodes
Laterally Contacted Blue Led with Superlattice Current Spreading Layer
Boron-Containing Buffer Layer for Growing Gallium Nitride on Silicon
N-Type Gallium-Nitride Layer Having Multiple Conductive Intervening Layers
High Temperature Gold-Free Wafer Bonding for Light Emitting Diodes
Led Having a Low Defect N-Type Layer That Has Grown on a Silicon Substrate
Buffer Layer for GaN-on-Si LED
Light Emitting Regions for Use with Light Emitting Devices
Light Emitting Devices Having Light Coupling Layers
Method for Reducing Stress in Epitaxial Growth
Gold Micromask for Roughening to Promote Light Extraction in an Led
Light Emitting Devices Having Shielded Silicon Substrates
Application:
14/114,312 →
Publication:
US 2014/0054638
Submount for Led Device Package
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Nov 12, 2012
From: BRIDGELUX, INC.
To: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
Reel/Frame 029281/0844 →
Assignment of Assignor's Interest
Jul 1, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 030724/0395 →
Assignment of Assignor's Interest
Aug 16, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 031023/0681 →
Assignment of Assignor's Interest
Dec 1, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: ALPAD CORPORATION
Reel/Frame 044591/0755 →
Assignment of Assignor's Interest
Jun 14, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 046364/0164 →
Assignment of Assignor's Interest
Aug 30, 2018
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046986/0159 →
Assignment of Assignor's Interest
Jan 24, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051691/0442 →
Assignment of Assignor's Interest
Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →