Wire bonding to connect electrodes
View Patent ↗A light emitting apparatus includes a semiconductor layer having an electrode with two traces physically separated from one another. The light emitting apparatus further includes a wire bond electrically connecting the two traces.
1. A light emitting apparatus, comprising:
a first semiconductor layer having a first electrode and a second semiconductor layer having a second electrode, wherein each electrode has two traces physically separated from one another by a gap; and
at least one wire bond electrically connecting the two traces of at least one of the respective first and second electrodes through one end of the wire bond by bridging the gap.
2. The light emitting apparatus of claim 1 wherein each of the two traces form a connecting pad, and wherein the wire bond is connected to the connecting pad to electrically connect the two traces.
3. The light emitting apparatus of claim 2 wherein the connecting pad is formed with the gap between the two traces, and wherein the wire bond extends across the gap.
4. The light emitting apparatus of claim 2 wherein a first one of the two traces terminates in a first plurality of fingers and a second one of the two traces terminates in a second plurality of fingers, wherein the connecting pad comprises the first and second plurality of fingers.
5. The light emitting apparatus of claim 4 wherein the first plurality of fingers is indigitated with the second plurality of fingers.
6. The light emitting apparatus of claim 2 wherein a first one of the two traces terminates in a first spiral pattern and a second one of the two traces terminates in a second spiral pattern, wherein the connecting pad comprises the first and second spiral patterns.
7. The light emitting apparatus of claim 6 wherein the first spiral pattern is interleaved with the second spiral pattern.
8. The light emitting apparatus of claim 1 further comprising a an active region between the first and second semiconductor layers.
9. A method of connecting a wire bond to an electrode, comprising:
forming a first electrode on a first semiconductor layer and a second electrode on a second semiconductor layer, each electrode being formed with two traces physically separated from one another by a gap; and
electrically connecting the two traces of at least one of the respective first and second electrodes with one end of a wire bond by bridging the gap.
10. The method of claim 9 wherein the two traces are formed with a connecting pad, and wherein the two traces are electrically connected by connecting the wire bond to the connecting pad.
11. The method of claim 10 wherein the connecting pad is formed with the gap between the two traces, and wherein the two traces are electrically connected by connecting the wire bond across the gap.
12. The method of claim 10 wherein the two traces are formed by terminating a first one of the two traces in a first plurality of fingers and terminating a second one of the two traces terminates in a second plurality of fingers, wherein the connecting pad comprises the first and second plurality of fingers.
13. The method of claim 12 wherein the two traces are formed by interleaving the first plurality of fingers with the second plurality of fingers.
14. The method of claim 10 wherein the two traces are formed by terminating a first one of the two traces in a first spiral pattern and terminating a second one of the two traces terminates in a second spiral pattern, wherein the connecting pad comprises the first and second spiral patterns.
15. The method of claim 14 wherein the two traces are formed by interleaving the first spiral pattern with the second spiral pattern.
16. The method of claim 9 further comprising forming an active region between the first and second semiconductor layers.