Surface mountable chip
View Patent ↗A surface mountable device having a circuit device and a base section. The circuit device includes top and bottom layers having a top contact and a bottom contact, respectively. The base section includes a substrate having a top base surface and a bottom base surface. The top base surface includes a top electrode bonded to the bottom contact, and the bottom base surface includes first and second bottom electrodes that are electrically isolated from one another. The top electrode is connected to the first bottom electrode, and the second bottom electrode is connected to the top contact by a vertical conductor. An insulating layer is bonded to a surface of the circuit device and covers a portion of a vertical surface of the bottom layer. The vertical conductor includes a layer of metal bonded to the insulating layer.
1. A method for fabricating a light source, said method comprising:
providing a light emitter section and a base section,
said light emitter section comprising a light generation layer on a first substrate, and a conducting layer in contact with said light generation layer, said light generation layer comprising a plurality of electrically insulated light section vias extending through said light generation layer to said first substrate,
said base section comprising a second substrate having a top base surface and a bottom base surface,
said top base surface comprising a first base electrode and a second base electrode corresponding to each light section via, said first base electrode and said second base electrode being electrically insulated from one another, said first base electrode being electrically connected to a first base power contact on said bottom surface and said second base electrode being electrically connected to a second power contact on said bottom surface,
bonding said base section to said light emitter section such that said first base electrode is aligned with said corresponding one of said light section vias and said second base electrode is bonded to said conducting layer of said light emitter section;
removing said first substrate; and
depositing metal in said light section vias that are aligned with said first base electrode.
2. The method of claim 1 further comprising singulating said bonded base section and light emitter section into individual light sources.
3. The method of claim 2 wherein said bonded base section and light emitter section is divided into individual light sources by dividing said bonded sections along singulation lines, and wherein trenches are formed in said light emitter section along said singulation lines prior to bonding said light emitter section to said base section.
4. The method of claim 2 wherein said singulating said bonded base section and light emitter section comprises dividing a conductor that extends from said top base surface to said bottom base surface into first and second conductors, said first conductor comprising part of said first base electrode in one of said light sources and said second conductor forming part of said second base electrode in another of said light sources.