Micro-bead blasting process for removing a silicone flash layer
View Patent ↗Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.
1. An apparatus, comprising:
a printed circuit board with a top side, a bottom side, and four edges;
a light emitting diode die disposed on the top side of the printed circuit board;
a contact pad disposed on the top side of the printed circuit board; and
a layer of silicone disposed over the light emitting diode die, wherein the layer of silicone extends to each of the four edges of the printed circuit board, and wherein the layer of silicone is not disposed laterally above a portion of the contact pad.
2. The apparatus of claim 1 , wherein the printed circuit board has no electrical contact on the bottom side.
3. The apparatus of claim 1 , wherein no holes pass from the top side of the printed circuit board to the bottom side of the printed circuit board.
4. The apparatus of claim 1 , wherein the layer of silicone forms a lens above the light emitting diode, and wherein there are less than three millimeters between the edge of the printed circuit board and an edge of the lens.
5. An apparatus, comprising:
a trace layer of a metal core printed circuit board;
a light emitting diode die that is electrically coupled to the trace layer;
a solder mask layer disposed over the trace layer, wherein a contact pad is formed on the trace layer by an opening in the solder mask; and
a layer of silicone disposed over the light emitting diode, wherein the layer of silicone forms an edge around the contact pad, wherein the layer of silicone contains a trace amount of a blasting medium at the edge, and wherein the blasting medium is taken from the group consisting of: sodium bicarbonate, sodium sulfate and ammonium bicarbonate.
6. The apparatus of claim 5 , wherein particles of phosphor are contained in the layer of silicone.
7. The apparatus of claim 5 , wherein the layer of silicone is not present laterally above the contact pad.
8. The apparatus of claim 5 , wherein the layer of silicone forms a lens above the light emitting diode.
9. The apparatus of claim 5 , wherein the metal core printed circuit board has an edge, and wherein there are less than three millimeters between the edge of the metal core printed circuit board and an edge of the lens.