IP Library › Granted Patent US 8,092,051
Granted Patent B2
US 8,092,051 · App. 12/848,484 · Granted Jan 10, 2012

Efficient LED array

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Quick Facts
Patent No.
US 8,092,051
App. No.
12/848,484
Granted
Jan 10, 2012
Kind
B2
Abstract

An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.

Claims (9)

1. A method for forming a light emitting diode (LED) apparatus, the method comprising:

configuring a metal substrate to have a reflective surface; and

mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to define an array having a chip spacing of at least 0.5 millimeters to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.

2. The method of claim 1 , wherein said configuring comprises configuring the reflective surface to comprise polished aluminum.

3. The method of claim 1 , wherein said configuring comprises configuring the reflective surface to comprise silver plating.

4. The method of claim 1 , wherein said configuring comprises configuring the reflective surface to have a reflectivity of 70% or greater.

5. The method of claim 1 , further comprising configuring the plurality of LED chips to provide separate thermal and electrical paths.

6. The method of claim 1 further comprising configuring the plurality of LED chips to have a first surface that is mounted to the reflective surface, and electrical contacts that are provided on one or more surfaces that are not the first surface.

7. The method of claim 1 , further comprising mounting the metal substrate directly to a heat sink.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2022
From: BRIDGELUX, INC.
To: BX LED, LLC
Reel/Frame 059048/0101 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL RECORDED AT REEL/FRAME 029281/0844 ON NOVEMBER 12, 2012 Recorded Nov 4, 2013
From: WELLS FARGO BANK, NATIONAL ASSOCIATION (SUCCESSOR BY ASSIGNMENT FROM WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT)
To: BRIDGELUX, INC.
Reel/Frame 031560/0102 →
SECURITY AGREEMENT Recorded Nov 12, 2012
From: BRIDGELUX, INC.
To: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
Reel/Frame 029281/0844 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2012
From: HELBING, RENE PETER
To: BRIDGELUX, INC.
Reel/Frame 028645/0408 →