Surface mountable chip
View Patent ↗A surface mountable device having a circuit device and a base section. The circuit device includes top and bottom layers having a top contact and a bottom contact, respectively. The base section includes a substrate having a top base surface and a bottom base surface. The top base surface includes a top electrode bonded to the bottom contact, and the bottom base surface includes first and second bottom electrodes that are electrically isolated from one another. The top electrode is connected to the first bottom electrode, and the second bottom electrode is connected to the top contact by a vertical conductor. An insulating layer is bonded to a surface of the circuit device and covers a portion of a vertical surface of the bottom layer. The vertical conductor includes a layer of metal bonded to the insulating layer.
1. A device comprising a circuit device and a base section,
said circuit device comprising a plurality of semiconductor layers including a top layer and a bottom layer, said top layer comprising a top surface having a top contact thereon and said bottom layer comprising a bottom surface and a bottom contact on said bottom surface, said circuit device requiring a potential difference between said top contact and said bottom contact to operate, and
said base section comprising a substrate having a top base surface and a bottom base surface, said top base surface being bonded to said bottom layer and said bottom base surface comprising first and second bottom electrodes that are electrically isolated from one another, said bottom contact being connected to said first bottom electrode by a first conductor and said second bottom electrode being connected to said top contact by a second conductor,
wherein said bottom layer comprises an insulating layer bonded to a surface thereof, and wherein said second conductor comprises a layer of metal bonded to said insulating layer, said insulating layer preventing contact between said second conductor and said bottom layer,
wherein said second conductor comprises a layer of metal bonded to an outer surface of said substrate.
2. The device of claim 1 wherein said circuit device comprises an LED.
3. The device of claim 1 wherein said top contact comprises a plurality of linear conductors that spread current over said top surface of said circuit device.
4. The device of claim 3 wherein said top contact covers less than 20 percent of said top surface of said circuit device.
5. A device comprising a circuit device and a base section,
said circuit device comprising a plurality of semiconductor layers including a top layer and a bottom layer, said top layer comprising a top surface having a top contact thereon and said bottom layer comprising a bottom surface and a bottom contact on said bottom surface, said circuit device requiring a potential difference between said top contact and said bottom contact to operate, and
said base section comprising a substrate having a top base surface and a bottom base surface, said top base surface being bonded to said bottom layer and said bottom base surface comprising first and second bottom electrodes that are electrically isolated from one another, said bottom contact being connected to said first bottom electrode by a first conductor and said second bottom electrode being connected to said top contact by a second conductor,
wherein said bottom layer comprises an insulating layer bonded to a surface thereof, and wherein said second conductor comprises a layer of metal bonded to said insulating layer, said insulating layer preventing contact between said second conductor and said bottom layer,
wherein said first conductor comprises a layer of metal bonded to another surface of said substrate.
6. The device of claim 5 wherein said circuit device comprises an LED.