Substrate free LED package
View Patent ↗A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
1. A method of fabricating a substrate free light emitting diode (LED), comprising:
arranging a plurality of LED dies on a tape to form an LED wafer assembly;
molding an encapsulation structure over at least one of the plurality of LED dies on a first side of the LED wafer assembly;
removing the tape;
forming a dielectric layer on a second side of the LED wafer assembly;
forming an oversized contact region on the dielectric layer; and
singulating the LED wafer assembly into predetermined regions comprising at least one LED.
2. The method of claim 1 , wherein the arranging of the plurality of LED dies on the tape comprises arranging the plurality of LED dies on a carrier tape.
3. The method of claim 2 , wherein the plurality of LED dies are arranged on a carrier tape using a pick and place procedure.
4. The method of claim 2 , further comprising, before the arranging of the plurality of LED dies on the carrier tape:
disposing a wafer having the plurality of LED dies on a saw tape;
singulating the plurality of LED dies by cutting the wafer completely through and partially cutting the saw tape to a depth less than a thickness of the saw tape; and
expanding the saw tape to increase spacing between the singulated plurality of LED dies.
5. The method of claim 1 , wherein the arranging the plurality of LED dies on the tape comprises arranging the plurality of LED dies on a saw tape.
6. The method of claim 5 , wherein the arranging the plurality of LED dies on the saw tape comprises:
disposing a wafer having the plurality of LED dies on the saw tape;
singulating the plurality of LED dies by cutting the wafer completely through and partially cutting the saw tape to a depth less than the a thickness of the saw tape; and
expanding the saw tape to increase spacing between the singulated plurality of LED dies.
7. The method of claim 1 , wherein the molding of the encapsulation structure comprises molding a phosphor loaded silicon material over the plurality of LED dies.
8. The method of claim 1 , wherein the molding of the encapsulation structure comprises molding a lens selected from the group consisting of a flat lens, a dome lens, or a Fresnel lens.
9. The method of claim 1 , further comprising forming a dielectric layer on a second side of the LED wafer assembly.
10. A method of fabricating a substrate free light emitting diode (LED), comprising:
arranging a plurality of LED dies on a tape to form an LED wafer assembly, the plurality of LED dies comprising die contacts;
molding an encapsulation structure over at least one of the plurality of LED dies on a first side of the LED wafer assembly;
removing the tape to expose the die contacts;
forming a dielectric layer on a second side of the LED wafer assembly;
electrically coupling at least one die contact from a first die with at least one die contact from a second die;
forming an oversized contact region on the dielectric layer; and
singulating the LED wafer assembly into predetermined regions comprising at least the electrically coupled first die and second die.
11. The method of claim 10 , wherein the arranging of the plurality of LED dies on the tape comprises arranging the plurality of LED dies on a carrier tape.
12. The method of claim 11 , wherein the plurality of LED dies are arranged on the carrier tape using a pick and place procedure.
13. The method of claim 12 , further comprising, before the arranging of the plurality of LED dies on the carrier tape:
disposing a wafer having the plurality of LED dies on the saw tape;
singulating the plurality of LED dies by cutting the wafer completely through and partially cutting the saw tape to a depth less than a thickness of the saw tape; and
expanding the saw tape to increase spacing between the singulated plurality of LED dies.
14. The method of claim 11 , wherein the arranging the plurality of LED dies on the tape comprises arranging the plurality of LED dies on a saw tape.
15. The method of claim 14 , wherein the arranging the plurality of LED dies on a saw tape comprises:
disposing a wafer having the plurality of LED dies on the saw tape;
singulating the plurality of LED dies by cutting the wafer completely through and partially cutting the saw tape to a depth less than the a thickness of the saw tape; and
expanding the saw tape to increase spacing between the singulated plurality of LED dies.