Packaging photon building blocks having only top side connections in a molded interconnect structure
View Patent ↗Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
1. A method of fabricating an LED system, comprising:
providing a substrate with an array of LED dies disposed on a top surface of the substrate, wherein electrical connections to the array of LED dies are made through a plurality of top-side contacts disposed only on the top surface of the substrate;
forming a lens over at least one of the LED dies using compression molding to shape a material that is disposed over substantially all of the top surface of the substrate; and
exposing the plurality of top-side contacts by selectively removing the material from areas covering the plurality of top-side contacts.
2. The method of claim 1 , wherein the providing the substrate includes providing a board, the board being a closed board.
3. The method of claim 2 , wherein the forming the lens includes disposing a compression molding material over substantially all of the closed board.
4. A method of fabricating an LED system, comprising:
providing a substrate with an array of LED dies disposed on a top surface of the substrate, wherein electrical connections to the array of LED dies are made through a plurality of top-side contacts disposed only on the top surface of the substrate;
forming a lens over at least one of the LED dies using compression molding to shape a material that is disposed over substantially all of the top surface of the substrate;
exposing the plurality of top-side contacts by selectively removing the material from areas covering the plurality of top-side contacts; and
detaching the substrate from the closed board.
5. A method of fabricating an LED system, comprising:
providing a substrate with an array of LED dies disposed on a top surface of the substrate, wherein electrical connections to the array of LED dies are made through a plurality of top-side contacts disposed only on the top surface of the substrate;
forming a lens over at least one of the LED dies using compression molding to shape a material that is disposed over substantially all of the top surface of the substrate; and
exposing the plurality of top-side contacts by selectively removing the material from areas covering the plurality of top-side contacts, wherein the exposing the plurality of top-side contacts includes blasting the material from areas covering the plurality of top-side contacts.
6. A method of fabricating an LED system, comprising:
providing a substrate with an array of LED dies disposed on a top surface of the substrate, wherein electrical connections to the LED dies are made through a plurality of top-side contacts disposed only on the top surface of the substrate;
forming a molded lens over at least one of the LED dies using molding to shape a material that is disposed over substantially all of the top surface of the substrate; and
exposing the plurality of top-side contacts by selectively de-flashing the material from areas covering the plurality of top-side contacts.
7. The method of claim 6 , wherein the providing the substrate further includes providing a closed board.
8. The method of claim 7 , wherein the forming the molded lens involves disposing the material over substantially all of the closed board.
9. The method of claim 7 , further comprising:
detaching the substrate from the closed board.
10. The method of claim 6 , wherein the exposing the plurality of top-side contacts involves blasting the material from areas covering the plurality of top-side contacts.
11. The method of claim 6 , further comprising:
forming a plurality of solder connections on the plurality of top-side contacts; and
connecting a plurality of leads to the plurality of solder connections, wherein the LED dies are connected only through the plurality of leads.
12. A method of fabricating an LED system, comprising:
forming a molded lens over LED dies that are disposed on a top surface of a substrate, wherein the molded lens is formed using molding to shape a material that is disposed over substantially all of the top surface of the substrate;
removing the material from areas above a plurality of top-side contacts that are disposed only on the top surface of the substrate; and
cutting the substrate from a closed board, wherein electrical connections to the LED dies are made only through the plurality of top-side contacts.
13. The method of claim 12 , wherein the substrate is rectangular and has four sides, and wherein the cutting the substrate forms a cut pattern on each of the four sides.
14. The method of claim 12 , wherein the cutting the substrate is performed by v-cutting the substrate from the closed board.
15. The method of claim 12 , wherein the cutting the substrate is performed by dicing the substrate from the closed board using a saw blade.
16. The method of claim 12 , wherein the cutting the substrate is performed by laser cutting the substrate from the closed board.
17. The method of claim 12 , wherein the cutting the substrate is performed by punch cutting the substrate from the closed board.
18. The method of claim 12 , wherein the cutting the substrate is performed using a combinations of techniques taken from the group consisting of: v-cutting, laser cutting, dicing with a saw blade and punch cutting.
19. The method of claim 12 , wherein the forming the molded lens involves disposing the material over substantially all of the closed board.
20. The method of claim 12 , wherein exposing the plurality of top-side contacts by selectively removing the material comprises involves blasting the material from areas covering the plurality of top-side contacts.
21. The method of claim 12 , further comprising:
forming a plurality of solder connections on the plurality of top-side contacts; and
connecting a plurality of leads to the plurality of solder connections, wherein the LED dies are connected only through the plurality of leads.