Non-global solder mask LED assembly
View Patent ↗A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
1. An LED assembly comprising:
a plurality of cups formed in the same substrate, wherein at least one cup is formed within another cup and wherein an inner one of the cups comprises at least one sloped wall and is configured to contain an LED die/dice; and
a non-global solder mask formed upon a metal layer only proximate where the LED die/dice are electrically connected to the metal layer, wherein use of the non-global solder mask enhances reflectivity of the LED assembly.
2. The LED assembly as recited in claim 1 , wherein portions of the substrate not covered by the non-global solder mask are reflective.
3. The LED assembly as recited in claim 1 , further comprising a machined surface formed upon the substrate, wherein the machined surface is configured to mount at least one LED die.
4. The LED assembly as recited in claim 1 , wherein the non-global solder mask is transparent.
5. The LED assembly as recited in claim 1 , further comprising a ring.
6. The LED assembly as recited in claim 1 , further comprising a transparent ring.
7. The LED assembly as recited in claim 5 , wherein the ring is attached to a substrate to facilitate the formation of at least one layer of material upon at least one LED die by containing the material, and at least one cup formed in the substrate, wherein the ring is attached to the substrate so as to generally surround the at least one cup.
8. A method for fabricating an LED assembly comprising:
forming a plurality of cups in the same substrate, wherein at least one cup is formed within another cup and wherein an inner one of the cups comprises at least one sloped wall and is configured to contain an LED die/dice; and
forming a non-global solder mask upon a metal layer only proximate where the LED die/dice are electrically connected to the metal layer, wherein use of the non-global solder mask enhances reflectivity of the LED assembly.
9. The method as recited in claim 8 , wherein the non-global solder mask is transparent.
10. The method of claim 8 , further comprising:
attaching a ring to the substrate; wherein the ring facilitates the formation of at least one layer of material upon the LED die/dice by containing the material; and
forming at least one cup in the substrate, wherein the ring is attached to the substrate so as to generally surround the at least one cup.