GaN based LED with etched exposed surface for improved light extraction efficiency and method for making the same
View Patent ↗A light-emitting device and the method for making the same are disclosed. The device includes a substrate, a light-emitting structure and a light scattering layer. The light-emitting structure includes an active layer sandwiched between a p-type GaN layer and an n-type GaN layer, the active layer emitting light of a predetermined wavelength when electrons and holes from the n-type GaN layer and the p-type GaN layer, respectively, combine therein. The light scattering layer includes a GaN crystalline layer characterized by an N-face surface. The N-face surface includes features that scatter light of the predetermined wavelength. The light-emitting structure is between the N-face surface and the substrate.
1. A method for making a light-emitting diode LED comprising:
fabricating a light-emitting structure on a substrate, said light emitting structure comprising an active layer sandwiched between a p-type GaN layer and an n-type GaN layer, said active layer emitting light of a predetermined wavelength when electrons and holes from said n-type GaN layer and said p-type GaN layer, respectively, combine therein, said light-emitting structure exposing a Ga-face of said p-type GaN on an exposed surface thereof;
depositing a p-type GaN transition structure on said exposed surface, said transition structure having an exposed N-face on an exposed surface thereof; and
etching said exposed N-face of said transition structure to generate features that scatter light of said predetermined wavelength.
2. The method of claim 1 wherein said exposed N-face of said transition structure is etched with NaOH.
3. The method of claim 1 wherein said transition structure comprises a layer of GaN doped with Mg to a concentration greater than or equal to 10 20 atoms/cm 3 .
4. The method of claim 1 wherein said transition structure comprises a layer of GaN doped with Mg to a concentration less than 10 20 atoms/cm 3 .