IP Library Granted Patent US 8,207,547
Granted Patent B2
US 8,207,547 · App. 12/482,413 · Granted Jun 26, 2012

Thin-film LED with P and N contacts electrically isolated from the substrate

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Quick Facts
Patent No.
US 8,207,547
App. No.
12/482,413
Granted
Jun 26, 2012
Kind
B2
Abstract

A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode.

Claims (16)

1. A thin-film light emitting diode, comprising:

an insulating substrate;

a conductive adhesive disposed directly on the insulating substrate;

a reflective metal electrode disposed directly on the conductive adhesive, wherein the conductive adhesive layer is metal and with the metal electrode together form a metallic current spreading layer, the metallic current spreading layer having a thickness greater than about 1 um; and

a single epitaxial structure on the electrode.

2. The thin-film light emitting diode of claim 1 , further comprising a metal layer on a bottom surface of the insulating substrate.

3. The thin-film light emitting diode of claim 1 , further comprising a metal contact coupled to the metal electrode.

4. The thin-film light emitting diode of claim 3 , wherein the metal contact is on the metal electrode.

5. The thin-film light emitting diode of claim 1 , wherein the insulating substrate is transparent for the wavelengths between about 300 nm and 700 nm with a transmittance greater than about 50%.

6. The thin-film light emitting diode of claim 1 , wherein the insulating substrate is reflective for the wavelength between about 300 nm and 700 nm with a reflectance greater than about 50%.

7. The thin-film light emitting diode of claim 1 , wherein the epitaxial structure comprises a first epitaxial layer, a second epitaxial layer, and an active region between the first epitaxial layer and the second epitaxial layer.

8. The thin film light emitting diode of claim 7 , wherein the first epitaxial layer has a roughened surface with micro-structures, the micro-structures being between about 100 nm and 500 nm in size.

9. The thin-film light emitting diode of claim 7 , wherein the first epitaxial layer is an n-type GaN-based layer and the second epitaxial layer is a p-type GaN-based layer.

10. The thin-film light emitting diode of claim 7 , further comprising a patterned second electrode is on the first epitaxial layer.

11. The thin-film light emitting diode of claim 10 , wherein the epitaxial structure is formed to be a mesa on the electrode and the patterned second electrode is on a top surface of the mesa.

12. The thin-film light emitting diode of claim 1 , wherein the insulating substrate is not an original growth substrate for the epitaxial structure.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2018
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046986/0159 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 046364/0164 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033265/0062 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 030724/0395 →
SECURITY AGREEMENT Recorded Nov 12, 2012
From: BRIDGELUX, INC.
To: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
Reel/Frame 029281/0844 →
RERECORD TO CORRECT CONVEYING PARTY/RECEIVING PARTY REEL/FRAME: 022812/0494 Recorded Feb 8, 2010
From: LIN, CHAO-KUN
To: BRIDGELUX, INC.
Reel/Frame 023972/0479 →