Light emitting diode with thin multilayer phosphor film
View Patent ↗A multiple layer film and a method of manufacturing the same, the film having a phosphor bearing layer including phosphor and a carrier, and a rigid protective layer. In some embodiments a mixture including phosphor and an uncurable fluid are dispensed onto a surface, and the mixture is at least partially dried. A curable fluid is dispensed onto the at least partially dried mixture, and the curable fluid is cured.
1. An apparatus comprising:
a light emitting device;
a phosphor bearing film arranged with the light emitting device, the phosphor bearing film comprising phosphor and a silicone carrier; and
a cured silicone film on the phosphor bearing film, the cured silicone film being substantially free of phosphor.
2. The apparatus of claim 1 , wherein the phosphor bearing film is 60%-80% phosphor.
3. The apparatus of claim 1 , wherein the phosphor bearing film is at least partially on the light emitting device.
4. The apparatus of claim 3 , further comprising a metallic package, wherein the light emitting device is in the metallic package.
5. The apparatus of claim 4 , wherein the phosphor bearing film is at least partially on a surface of the metallic package.
6. The apparatus of claim 5 , further comprising a heat sink, wherein the package is on the heat sink.
7. An apparatus comprising:
a light emitting device;
a phosphor bearing film arranged with the light emitting device, the film comprising phosphor and a carrier, wherein the phosphor bearing film is 60%-80% phosphor; and
a rigid film on the phosphor bearing film.
8. The apparatus of claim 7 wherein the carrier comprises silicone.
9. The apparatus of claim 7 wherein the rigid film comprises a transparent cured silicone film.
10. The apparatus of claim 7 , further comprising a metallic package, wherein the light emitting device is in the metallic package.
11. The apparatus of claim 10 , wherein the phosphor bearing film is at least partially on a surface of the package.
12. The apparatus of claim 10 , further comprising a heat sink, wherein the package is on the heat sink.