Method for manufacturing a reflective surface sub-assembly for a light-emitting device
View Patent ↗A method for manufacturing a reflective surface sub-assembly for a light-emitting device, comprising a substrate, at least one area reserved for placement of a light-emitting device assembly on the substrate, and a diffusive reflective layer applied on selected regions on the substrate, wherein if the light-emitting device assembly were placed onto the at least one area then the diffusive reflective layer would reflect photons emitted by the light-emitting device assembly is disclosed.
1. A method for manufacturing a reflective surface sub-assembly for a light-emitting device, the method comprising the steps of:
predetermining at least one area reserved for placement of a light-emitting device assembly on a substrate;
manufacturing the substrate;
applying a reflective layer selected from a group consisting of noble metal, Ag, and Al, on the substrate; and
applying a diffusive reflective surface on selected regions on the substrate with the applied reflective layer; wherein when the light-emitting device assembly were placed onto the at least one area, then the reflective layer and the diffusive reflective layer would reflect photons emitted by the light-emitting device assembly.
2. The method according to claim 1 , wherein the step of manufacturing a substrate comprises the step of manufacturing a substantially flat substrate.
3. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises the step of applying a diffusive reflective layer characterized by at least 50% diffusive reflectivity.
4. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises the step of applying a diffusive reflective layer characterized by at least 70% diffusive reflectivity.
5. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises the step of applying a diffusive reflective layer to fill irregularities in a face of the substrate.
6. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises the step of applying a diffusive reflective layer comprising titanium oxide or other oxide phases or compositions.
7. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises the step of applying a diffusive reflective layer comprising titanium dioxide.
8. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises applying a paste comprising:
a polymer matrix,
a titanium oxide or other oxide phases or compositions filler, and
a rheological additive.
9. The method according to claim 8 , wherein the rheological additive comprises a silica and alumna.
10. The method according to claim 9 , wherein the loading levels of the paste's composition comprise:
the titanium oxide or other oxide phases or compositions filler in an amount of 10%-75%,
the silica in an amount of 0%-4%, and
the alumna in an amount of 0.1-2%.
11. The method according to claim 10 , wherein the titanium oxide or other oxide phases or compositions filler comprises titanium dioxide filler.
12. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises the step of applying a diffusive reflective layer excluding the at least one area reserved for placement of a light-emitting device assembly.
13. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises the step of applying a diffusive reflective layer including the at least one area reserved for placement of a light-emitting device assembly.
14. The method according to claim 1 , wherein the step of predetermining at least one area reserved for placement of a light-emitting device assembly comprises predetermining at least one area equivalent with the area of the light-emitting device assembly to be placed on the at least one area reserved for placement.
15. The method according to claim 1 , wherein the step of predetermining at least one area reserved for placement of a light-emitting device assembly comprises predetermining at least one area greater than the area of the light-emitting device assembly to be placed on the at least one area reserved for placement.
16. The method according to claim 1 , wherein the step of applying a diffusive reflective surface on selected regions on a substrate comprises applying a diffusive reflective surface on selected regions on a substrate by screen-printing.
17. The method according to claim 1 , further comprising a step of placing a light-emitting device assembly on the at least one area reserved for placement of the light-emitting device assembly.
18. A method of manufacturing an apparatus, comprising the method of manufacturing a reflective surface sub-assembly of claim 1 , and further comprising placing a semiconductor light-emitting device assembly on the at least one area reserved for placement thereof.