IP Library Granted Patent US 8,796,708
Granted Patent B2
US 8,796,708 · App. 12/892,796 · Granted Aug 5, 2014

LED structure to increase brightness

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Quick Facts
Patent No.
US 8,796,708
App. No.
12/892,796
Granted
Aug 5, 2014
Kind
B2
Abstract

A light emitting semiconductor device comprising an LED having an emission aperture located on a surface of the LED and the emission aperture has a size that is smaller than a surface area of the LED where the emission aperture is formed. The device further includes a reflector surrounding both side walls, a bottom surface, and portions of a surface of the LED where the emission aperture is formed or surrounding the bottom surface and portions of the surface of the LED where the emission aperture is formed so that an area on the surface uncovered by the reflector is the emission aperture and is smaller than the area of the LED. Alternatively, in the light emitting semiconductor, the surface of the LED substantially aligned with the emission aperture may be roughened and the surface of the LED beyond the emission aperture may be smooth. The surface of the LED beyond the emission aperture may also be covered by a low loss reflector.

Claims (12)

1. A light emitting semiconductor device comprising:

a light emitting diode having two side walls, a bottom surface and a top surface, and having an emission aperture located on the top surface of the light emitting diode; and

a reflector formed on the light emitting diode on a portion of the top surface of the light emitting diode surrounding and in direct contact with the two side walls and the bottom surface of the light emitting diode, wherein an area on the top surface of the light emitting diode not covered by the reflector constitutes the emission aperture,

wherein the emission aperture has a size that is smaller than a surface area of the to surface of the light emitting diode.

2. The light emitting semiconductor device of claim 1 , wherein the reflector is selected from one of silver, dielectric materials, and combinations thereof.

3. The light emitting semiconductor device of claim 1 , wherein the surface of the light emitting diode substantially aligned with the emission aperture is roughened.

4. The light emitting semiconductor device of claim 3 , wherein the surface of the light emitting diode beyond the emission aperture is smooth.

5. The light emitting semiconductor device of claim 4 , wherein the surface of the light emitting diode beyond the emission aperture is covered by a low loss reflector.

6. The light emitting semiconductor device of claim 4 , wherein the smooth surface forms a total-internal reflection (TIR) area.

7. A light emitting semiconductor device comprising:

a light emitting diode having an emission aperture located on a surface of the light emitting diode, wherein an emitted light flux and solid angle of emission are constant, independent of a size of the emission aperture,

wherein the light emitting diode having one or more side walls, a bottom surface, and a top surface, further comprises a reflector formed to reflect light internally in the light emitting diode on the bottom surface and portions of the top surface, wherein the emission aperture is an area on the top surface not covered by the reflector, and wherein the emission aperture has a smaller size than a top surface area of the light emitting diode.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033201/0707 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 030724/0395 →
SECURITY AGREEMENT Recorded Nov 12, 2012
From: BRIDGELUX, INC.
To: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
Reel/Frame 029281/0844 →