IP Library Granted Patent US 7,825,425
Granted Patent B2
US 7,825,425 · App. 12/183,020 · Granted Nov 2, 2010

LED structure to increase brightness

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,825,425
App. No.
12/183,020
Granted
Nov 2, 2010
Kind
B2
Abstract

A light emitting semiconductor device comprising an LED having an emission aperture located on a surface of the LED and the emission aperture has a size that is smaller than a surface area of the LED where the emission aperture is formed. The device further includes a reflector surrounding both side walls, a bottom surface, and portions of a surface of the LED where the emission aperture is formed or surrounding the bottom surface and portions of the surface of the LED where the emission aperture is formed so that an area on the surface uncovered by the reflector is the emission aperture and is smaller than the area of the LED. Alternatively, in the light emitting semiconductor, the surface of the LED substantially aligned with the emission aperture may be roughened and the surface of the LED beyond the emission aperture may be smooth. The surface of the LED beyond the emission aperture may also be covered by a low loss reflector.

Claims (20)

1. A light emitting semiconductor device comprising:

an LED having an emission aperture located on a top surface of the LED, the LED having two side walls, a bottom surface, and the top surface; and

a reflector contacting the LED to surround the LED on the two side walls, the bottom surface, and portions of the top surface,

wherein an area on the top surface uncovered by the reflector is the emission aperture and the emission aperture has a size that is smaller than a surface area of the LED where the emission aperture is formed.

2. The light emitting semiconductor device of claim 1 , wherein the reflector is selected from one of silver, dielectric materials, and combinations thereof.

3. The light emitting semiconductor device of claim 1 , wherein the surface of the LED substantially aligned with the emission aperture is roughened.

4. The light emitting semiconductor device of claim 3 , wherein the surface of the LED beyond the emission aperture is smooth.

5. The light emitting semiconductor device of claim 4 , wherein the reflector is a low loss reflector.

6. The light emitting semiconductor device of claim 4 , wherein the smooth surface forms a total-internal reflection (TIR) area.

7. A light emitting semiconductor device, comprising

an LED having two side walls, a bottom surface, a top surface, and an emission aperture located on the top surface of the LED; and

a reflector formed on the bottom surface, the two side walls, and portions of the top surface of the LED, wherein an area on the top surface uncovered by the reflector forms the emission aperture and is smaller than an area of the LED.

8. The light emitting semiconductor device of claim 7 , wherein the reflector is selected from one of silver and dielectric materials.

9. A light emitting semiconductor device, comprising:

an LED having an emission aperture located on a surface of the LED; and

a reflector contacting surfaces of the LED other than the emission aperture to surround the LED,

wherein an area of the emission aperture is smaller than a surface area of the LED, and the emission aperture is roughened.

10. The light emitting semiconductor device of claim 9 , wherein the surface of the LED beyond the emission aperture is smooth.

11. The light emitting semiconductor device of claim 10 , wherein the smooth surface forms a total-internal reflection (TIR) area.

12. The light emitting semiconductor device of claim 10 , wherein the reflector is a low loss reflector.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033169/0625 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 030724/0395 →
RELEASE OF SECURITY INTEREST Recorded Jun 24, 2013
From: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
To: BRIDGELUX, INC.
Reel/Frame 030672/0155 →
SECURITY AGREEMENT Recorded Nov 12, 2012
From: BRIDGELUX, INC.
To: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
Reel/Frame 029281/0844 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2008
From: SHUM, FRANK
To: BRIDGELUX INC.
Reel/Frame 021318/0854 →