IP Library Granted Patent US 7,859,190
Granted Patent B2
US 7,859,190 · App. 12/208,142 · Granted Dec 28, 2010

Phosphor layer arrangement for use with light emitting diodes

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Quick Facts
Patent No.
US 7,859,190
App. No.
12/208,142
Granted
Dec 28, 2010
Kind
B2
Abstract

Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.

Claims (20)

1. A light emitting diode apparatus comprising:

at least one light emitting diode;

an encapsulation covering the at least one light emitting diode;

a stepped reflector that forms a boundary for the encapsulation wherein said stepped reflector comprises a wire bonding region;

a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation; and

an air gap between the phosphor layer and the encapsulation.

2. The apparatus of claim 1 , wherein said phosphor layer comprises an inorganic dye.

3. The apparatus of claim 1 , wherein said phosphor layer has a uniform thickness.

4. The apparatus of claim 1 , wherein said phosphor layer has a varying thickness.

5. The apparatus of claim 1 , wherein said phosphor layer has a thickness in the range of 5 to 500 microns.

6. The apparatus of claim 1 , wherein said air gap has a thickness in the range of 5 to 1000 microns.

7. A method for forming a light emitting diode apparatus, the method comprising:

encapsulating at least one light emitting diode with an encapsulation;

forming a stepped reflector as a boundary for the encapsulation wherein the stepped reflector comprises a wire bonding region;

covering the encapsulation with a lens having a phosphor layer formed upon a bottom surface, wherein an air gap is formed between the encapsulation and the phosphor layer.

8. The method of claim 7 , further comprising forming the phosphor layer with an inorganic dye.

9. The method of claim 7 , further comprising forming the phosphor layer to have a uniform thickness.

10. The method of claim 7 , further comprising forming the phosphor layer to have a varying thickness.

11. The method of claim 7 , further comprising forming the phosphor layer to have a thickness in the range of 5 to 500 microns.

12. The method of claim 7 , further comprising forming the air gap to have a thickness in the range of 5 to 1000 microns.

Assignments (2)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL RECORDED AT REEL/FRAME 029281/0844 ON NOVEMBER 12, 2012 Recorded Nov 4, 2013
From: WELLS FARGO BANK, NATIONAL ASSOCIATION (SUCCESSOR BY ASSIGNMENT FROM WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT)
To: BRIDGELUX, INC.
Reel/Frame 031560/0102 →
SECURITY AGREEMENT Recorded Nov 12, 2012
From: BRIDGELUX, INC.
To: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
Reel/Frame 029281/0844 →