Reformed battery grids
A method of making a grid for a battery plate of a lead-acid battery. A substantially planar web is manufactured to include a plurality of spaced apart and interconnected wire segments, which at least partially define substantially planar surfaces, have a plurality of transverse lands, and interconnect at a plurality of nodes to define a plurality of open spaces between the wire segments. The web is reformed to change the cross-sectional shape of the wire segments. Other aspects may include simultaneously reducing the thickness of at least a portion of the web while reshaping the wire segments, and/or providing controlled surface roughness on at least one of the surfaces of the web to increase surface area of the grid and thereby promote adhesion of an electrochemically active material to the grid.
1. A method of making a grid for a battery plate for a lead-acid battery, comprising:
punching a cast or cast and rolled lead alloy solid strip to form a grid strip of the lead alloy having a plurality of connected grids with each grid having a generally planar surface, a plurality of spaced-apart wire segments interconnected at nodes, and a plurality of open spaces between the wire segments;
stamping the plurality of the wire segments of each grid with a reforming die without removing lead alloy from them, to change the transverse cross-sectional shape of said wire segments of each grid and thereby forming on said wire segments respective land surfaces inclined at an angle which is neither perpendicular nor parallel to the generally planar surface of the grid; and
forming a controlled surface roughness having a substantially uniform distribution and a size of about 100 micro inches Ra to 900 micro inches Ra on the plurality of the inclined land surfaces of the wire segments of each grid with stamping or rolling dies without removing lead alloy from said wire segments to promote adhesion to said plurality of wire segments of each grid of subsequently applied and cured battery paste.
2. The method of claim 1 wherein the controlled surface roughness is in the range of about 200 micro-inches Ra to 900 micro-inches Ra.
3. The method of claim 1 wherein the controlled surface roughness is in the range of about 200 micro-inches Ra to 600 micro-inches Ra.
4. The method of claim 1 wherein forming the controlled surface roughness further comprises stamping at least four inclined land surfaces on at least some of the wire segments of each grid.
5. The method of claim 1 wherein the controlled surface roughness is formed with stamping dies.
6. The method of claim 1 wherein the controlled surface roughness is formed with rolling dies.
7. The method of claim 1 wherein the stamping of the plurality of the wire segments of each grid further comprises reducing the maximum thickness of at least a portion of at least some of said wire segments.
8. The method of claim 7 wherein the degree of reduction in thickness of said wire segments of each grid is by a factor of 1.2:1 to 2:1.
9. The method of claim 1 wherein the punching of the lead alloy solid strip to form the grid strip further comprises forming a frame of each grid; and wherein the stamping of the plurality of the wire segments of each grid further comprises reducing the thickness of at least one segment of the frame and reducing the thickness of at least some of the wire segments of each grid with the degree of reduction in thickness of said wire segments of each grid being different than the degree of reduction in thickness of said at least one frame segment of each grid.
10. The method of claim 9 wherein the degree of reduction in thickness of said wire segments of each grid is by a factor of about 1.2:1 to 2:1.
11. The method of claim 1 which further comprises forming at least one sacrificial strip extending along and integral with the grid strip and having locating holes through the at least one sacrificial strip and the forming of the controlled surface roughness on the wire segments of each grid is accomplished with the stamping or rolling die being registered with at least one of the locating holes of the sacrificial strip while forming said controlled surface roughness.
12. The method of claim 1 further comprising applying an electrochemically active paste to each grid including said controlled surface roughness of the inclined lands of at least some of the wire segments of each grid to produce a battery plate.
13. A method of making a grid for a battery plate for a lead-acid battery, comprising:
piercing and pulling a cast or cast and rolled lead alloy solid strip to form a grid strip of the lead alloy having a plurality of connected grids with each grid having a generally planar surface, a plurality of spaced-apart wire segments interconnected at nodes, and a plurality of open spaces between the wire segments;
stamping the plurality of the wire segments of each grid with a reforming die without removing lead alloy from them, to change the transverse cross-sectional shape of said wire segments of each grid and thereby forming on said wire segments respective land surfaces inclined at an angle which is neither perpendicular nor parallel to the generally planar surface of the grid; and
forming a controlled surface roughness having a substantially uniform distribution and a size of about 100 micro inches Ra to 900 micro inches Ra on the plurality of the inclined land surfaces of the wire segments of each grid with stamping or rolling dies without removing lead alloy from said wire segments to promote adhesion to said plurality of wire segments of each grid of subsequently applied and cured battery paste.
14. The method of claim 13 wherein the controlled surface roughness is in the range of about 200 micro-inches Ra to 900 micro inches Ra.
15. The method of claim 13 wherein the controlled surface roughness is in the range of about 200 micro-inches Ra to 600 micro-inches Ra.
16. The method of claim 13 wherein forming the controlled surface roughness further comprise stamping at least four inclined land surfaces on at least some of the wire segments of each grid.
17. The method of claim 13 wherein the controlled surface roughness is formed with stamping dies.
18. The method of claim 13 wherein the controlled surface roughness is formed with rolling dies.
19. The method of claim 13 wherein the stamping of the plurality of the wire segments of each grid further comprises reducing the maximum thickness of at least a portion of at least some of said wire segments.
20. The method of claim 19 wherein the degree of reduction in thickness of said wire segments of each grid is by a factor of 1.2:1 to 2:1.
21. The method of claim 13 wherein the punching of the lead alloy solid strip to form the grid strip further comprises forming a frame of each grid; and wherein the stamping of the plurality of the wire segments of each grid further comprises reducing the thickness of at least one segment of the frame and reducing the thickness of at least some of the wire segments of each grid with the degree of reduction in thickness of said wire segments of each grid being different than the degree of reduction in thickness of said at least one frame segment of each grid.
22. The method of claim 21 wherein the degree of reduction in thickness of said wire segments of each grid is by a factor of about 1.2:1 to 2:1.
23. The method of claim 13 which further comprises forming at least one sacrificial strip extending along and integral with the grid strip and having locating holes through said at least one sacrificial strip and the forming of the controlled surface roughness the wire segments of each grid is accomplished with the stamping or rolling die being registered with at least one of the locating holes of the sacrificial strip while forming said controlled surface roughness.
24. The method of claim 13 further comprising applying an electrochemically active paste to each grid including said surface roughness of the inclined lands of at least some of the wire segments of each grid to produce a battery plate.
25. A method of making a grid for a battery plate for a lead-acid battery, comprising:
continuous casting a molten lead alloy to form a grid strip of the lead alloy having a plurality of connected grids with each grid having a generally planar surface, a plurality of spaced-apart wire segments interconnected at nodes, and a plurality of open spaces between the wire segments;
stamping the plurality of the wire segments of each grid with a reforming die without removing lead alloy from them, to change the transverse cross-sectional shape of said wire segments of each grid and thereby forming on said wire segments respective land surfaces inclined at an angle which is neither perpendicular nor parallel to the generally planar surface of the grid; and
forming a controlled surface roughness having a substantially uniform distribution and a size of about 100 micro-inches Ra to 900 micro-inches Ra on the plurality of the inclined land surfaces of the wire segments of each grid with stamping or rolling dies without removing lead alloy from said wire segments to promote adhesion to said plurality of wire segments of each grid of subsequently applied and cured battery paste.
26. The method of claim 25 wherein the controlled surface roughness is in the range of about 200 micro-inches Ra to 900 micro inches Ra.
27. The method of claim 25 wherein the controlled surface roughness is in the range of about 200 micro-inches Ra to 600 micro-inches Ra.
28. The method of claim 25 wherein forming the controlled surface roughness further comprises stamping at least four inclined land surfaces on at least some of the wire segments of each grid.
29. The method of claim 25 wherein the controlled surface roughness is formed with stamping dies.
30. The method of claim 25 wherein the controlled surface roughness is formed with rolling dies.
31. The method of claim 25 wherein the stamping of the plurality of the wire segments of each grid further comprises reducing the maximum thickness of at least a portion of at least some of said wire segments.
32. The method of claim 25 wherein the degree of reduction in thickness of said wire segments of each grid is by a factor of 1.2:1 to 2:1.
33. The method of claim 25 wherein the punching of the lead alloy solid strip to form the grid strip further comprises forming a frame of each grid; and wherein the stamping of the plurality of the wire segments of each grid further comprises reducing the thickness of at least one segment of the frame and reducing the thickness of at least some of the wire segments of each grid with the degree of reduction in thickness of said wire segments of each grid being different than the degree of reduction in thickness of said at least one frame segment of each grid.
34. The method of claim 25 wherein the degree of reduction in thickness of said wire segments of each grid is by a factor of about 1.2:1 to 2:1.
35. The method of claim 25 which further comprises forming at least one sacrificial strip extending along and integral with the grid strip and having locating holes through said at least one sacrificial strip and the forming of the controlled surface roughness on the wire segments of each grid is accomplished with the stamping or rolling die being registered with at least one of the locating holes of the sacrificial strip while forming said controlled surface roughness.
36. The method of claim 25 further comprising applying an electrochemically active paste to each grid including said surface roughness of the inclined lands of at least some of the wire segments of each grid to produce a battery plate.