Semiconductor device and method for manufacturing the same
View Patent ↗A semiconductor device including a capacitor formed over a semiconductor substrate and including a lower electrode, a dielectric film formed over the lower electrode and an upper electrode formed over the dielectric film, an insulation film formed over the semiconductor substrate and the capacitor, and an electrode pad formed over the insulation film and including an alloy film of aluminum and magnesium.
1. A semiconductor device comprising:
a capacitor formed over a semiconductor substrate and including a lower electrode, a dielectric film formed over the lower electrode and an upper electrode formed over the dielectric film;
an insulation film formed over the semiconductor substrate and the capacitor; and
an electrode pad formed over the insulation film and including an alloy film of aluminum and magnesium,
wherein a content ratio of aluminum of the alloy film of aluminum and magnesium is 1-20 weight %.
2. The semiconductor device according to claim 1 , further comprising
a first conducting barrier film formed over the electrode pad and preventing a diffusion of hydrogen or water.
3. The semiconductor substrate according to claim 2 , further comprising
a second barrier film formed above at least the capacitor and preventing a diffusion of hydrogen or water.
4. The semiconductor device according to claim 3 , wherein
the first conducting barrier film and the second barrier film are formed of one and the same conducting film.
5. The semiconductor device according to claim 2 , further comprising
a bump electrode formed over the first conducting barrier film.
6. The semiconductor device according to claim 1 , further comprising
a protection film formed over the insulation film, having an opening formed in down to the electrode pad and preventing a diffusion of water.
7. The semiconductor device according to claim 6 , wherein
the protection film is formed flat.
8. The semiconductor device according to claim 2 , wherein
the first conducting barrier film includes a Pd film.
9. The semiconductor device according to claim 3 , wherein
the second barrier film includes a Pd film.
10. The semiconductor device according to claim 1 , wherein
the dielectric film is formed of ferromagnetic or high dielectric.
11. The semiconductor device according to claim 10 , wherein
the dielectric film is PbZr 1-x Ti x O 3 film, Pb 1-x La x Zr 1-y Ti y O 3 film, SrBi 2 (Ta x Nb 1-x ) 2 O 9 film or Bi 4 Ti 2 O 12 film.
12. A semiconductor device comprising:
a capacitor formed over a semiconductor substrate and including a lower electrode, a dielectric film formed over the lower electrode and an upper electrode formed over the dielectric film;
an insulation film formed over the semiconductor substrate and the capacitor;
an electrode pad formed over the insulation film and including an alloy film of aluminum and magnesium; and
a first conducting barrier film formed over the electrode pad and preventing a diffusion of hydrogen or water,
wherein an outer periphery of the first conducting barrier film is larger than an outer periphery of the electrode pad.
13. The semiconductor device according to claim 3 , wherein
the second barrier film is formed also above a peripheral circuit region outside a memory cell region where the capacitor is formed.
14. The semiconductor device according to claim 3 , wherein
the second barrier film is formed, covering a whole surface of the insulation film except a region where the first conducting barrier film is formed.
15. A method for manufacturing a semiconductor device comprising:
forming over a semiconductor substrate a capacitor including a lower electrode, a dielectric film formed over the lower electrode, and an upper electrode formed over the dielectric film;
forming an insulation film over the semiconductor substrate and the capacitor; and
forming over the insulation film an electrode pad including an alloy film of aluminum and magnesium,
wherein a content ratio of aluminum of the alloy film of aluminum and magnesium is 1-20 weight %.
16. A method for manufacturing a semiconductor device comprising:
forming over a semiconductor substrate a capacitor including a lower electrode, a dielectric film formed over the lower electrode, and an upper electrode formed over the dielectric film;
forming an insulation film over the semiconductor substrate and the capacitor;
forming over the insulation film an electrode pad including an alloy film of aluminum and magnesium; and
contacting a probe of a test system to the electrode pad to make a test.
17. The method for manufacturing the semiconductor device according to claim 16 , further comprising, after the making the test, forming over the electrode pad a conducting barrier film for preventing a diffusion of hydrogen and water.
18. The method for manufacturing the semiconductor device according to claim 17 , further comprising, after the forming the barrier film, forming a bump electrode over the barrier film.