Transponder card
A transponder card comprises a carrier substrate arranged without interlayers between two protective plastic plates, a planar frame antenna, on the substrate with two supply connections and a conductor track connecting the supply connections, and an integrated circuit with two antenna connections. The antenna connections are electrically connected to the two supply connections and the integrated circuit is arranged such that the conductor track does not run through between the antenna connections. The conductor track may include at least two first conductor track segments and at least one second conductor track segment. Each end of the second conductor track segment is electrically connected to a respective first conductor track segment. The second conductor track segment crosses at least one of the two first conductor track segments at least once and is electrically insulated from the first conductor track segment by at least one nonconductive separation element.
1. A transponder card, comprising a carrier substrate arranged without interlayers between two protective plates composed of plastic, a planar frame antenna on the substrate with two supply connections and a conductor track connecting the supply connections, and an integrated circuit with two antenna connections, wherein the antenna connections are electrically connected to the two supply connections and the integrated circuit is arranged relative to the frame antenna such that the conductor track does not run through between the antenna connections of the integrated circuit.
2. The transponder card as claimed in claim 1 , wherein the protective plates are fabricated from PVC.
3. The transponder card as claimed in claim 1 , wherein the protective plates are fabricated from PC.
4. The transponder card as claimed in claim 1 , wherein the carrier substrate is fabricated from the same plastic as the protective plates.
5. The transponder card as claimed in claim 1 , wherein the carrier substrate is fabricated from PET.
6. The transponder card as claimed in claim 1 , wherein the carrier substrate is fabricated from fibrous material.
7. The transponder card as claimed in claim 1 , wherein the integrated circuit is a printed circuit.
8. The transponder card as claimed in claim 1 , wherein the integrated circuit is a semiconductor chip, and the antenna connections are directly connected to the supply connections of the frame antenna.
9. The transponder card as claimed in claim 1 , wherein the frame antenna is produced by selectively removing a conductive layer provided on the carrier substrate.
10. The transponder card as claimed in claim 9 , wherein the frame antenna is fabricated in a wet-chemical etching method.
11. The transponder card as claimed in claim 10 , wherein the frame antenna is fabricated in a metal deposition method.
12. The transponder card as claimed in claim 1 , wherein the frame antenna is produced by selectively forming a conductive layer on the carrier substrate.
13. The transponder card as claimed in claim 12 , wherein the frame antenna is fabricated in a printing method.
14. A transponder card, comprising a carrier substrate, arranged without interlayers between two protective plates composed of plastic, a planar frame antenna on the substrate with two supply connections and a conductor track connecting the supply connections, and an integrated circuit with two antenna connections, wherein the conductor track has at least two first conductor track segments and at least one second conductor track segment, wherein each end of the second conductor track segment is electrically connected to a respective first conductor track segment, the second conductor track segment crosses at least one of the two first conductor track segments at least once and is electrically insulated from the first conductor track segment by at least one nonconductive separation element at least in a crossover region.
15. The transponder card as claimed in claim 14 , wherein the separation element is formed by the carrier substrate.
16. The transponder card as claimed in claim 14 , wherein the separation element is formed by an additional nonconductive layer.