Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic
View Patent ↗An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent including a flexibilizer containing functional groups capable of reaction with the epoxy or cyanate ester resin during thermally induced curing, a filler material including substantially spherical or spheroidal particles such that each particle has a diameter less than about 41 microns, and a thermoplastic other than the flexibilizer. The thermoplastic is separated from the cured epoxy or cyanate ester resin. The thermoplastic includes a poly(arylene)ether. The flexibilizer includes bis(2,3-epoxy-2-methylpropyl)ether.
1. An encapsulant composition, comprising:
a resin material selected from the group consisting of epoxy and cyanate ester resins;
from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent comprising a flexibilizer containing functional groups capable of reaction with the epoxy or cyanate ester resin during thermally induced curing, and a thermoplastic other than the flexibilizer, wherein the thermoplastic is separated from the cured epoxy or cyanate ester resin, wherein the thermoplastic comprises a poly(arylene) ether, and wherein the flexibilizer comprises bis(2,3-epoxy-2-methylpropyl)ether; and
a filler material comprising substantially spherical or spheroidal particles, each particle having a diameter less than about 41 microns.
2. The encapsulant composition of claim 1 , wherein the composition has a higher fracture toughness, a lower viscosity, and increased thermal shock resistance at a temperature excursion below −40° C., or combinations thereof than the composition would have if the flexibilizing agent were not present in the composition.
3. The encapsulant composition of claim 1 , wherein the resin material consists of said cyanate ester resins.
4. The encapsulant composition of claim 3 , wherein the cyanate ester resins comprise 4,4-ethylidenebisphenoldicyanate.
5. The encapsulant composition of claim 1 , wherein the filler material comprising substantially spherical or spheroidal particles includes silicon carbide.
6. The encapsulant composition of claim 1 , wherein each particle of the filler material has a diameter less than about 31 microns.