Semiconductor wafer storage case and semiconductor wafer storing method

1. A semiconductor wafer storage case comprising:

a plurality of support members that are spaced at predetermined intervals with respect to each other, each of which supporting members is in contact with a peripheral edge region of a bottom surface of a semiconductor wafer; and

an elastic member arranged in each of the plurality of support members to elastically support a top surface of the semiconductor wafer on a corresponding one of the plurality of support members, the elastic member including a clamper to come into contact with an inner point of the top surface of the semiconductor wafer when the storage case is compressed and the corresponding one of the plurality of support members contacts the peripheral edge region of the bottom surface of the semiconductor wafer, the inner point of the top surface being located at a predetermined distance from a peripheral edge of the semiconductor wafer, said clamper pressing the inner point of the top surface of the semiconductor wafer onto the corresponding one of the plurality of support members.

2. The semiconductor wafer storage case as claimed in claim 1 , wherein:

the semiconductor wafer includes a circuit-patterned surface corresponding to the top surface of the semiconductor wafer.

3. The semiconductor wafer storage case as claimed in claim 1 , wherein

each of the plurality of supporting members is a flat plane member that is made of rigid resin or metal.

4. The semiconductor wafer storage case as claimed in claim 1 , wherein

each of the plurality of supporting members is a U-shaped plate made of resin or metal that is processed to be electrostatic-free.