IP Library Granted Patent US 7,598,551
Granted Patent B2
US 7,598,551 · App. 12/132,631 · Granted Oct 6, 2009

High voltage device

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Quick Facts
Patent No.
US 7,598,551
App. No.
12/132,631
Granted
Oct 6, 2009
Kind
B2
Abstract

The invention is directed to a method for manufacturing a high voltage device. The method includes steps of providing a substrate and then forming a first doped region having a first conductive type in the substrate. At least two second doped regions having a second conductive type are formed in the substrate. The second doped regions are located adjacent to both sides of the first doped region respectively, and the first doped region is separated from the second doped regions with an isolation region. A gate structure is formed on the substrate between the second doped regions and a source/drain region having the second doped region is formed in the substrate adjacent to both sides of the gate structure.

Claims (12)

1. A high voltage device, comprising:

a plurality of isolation structures located in a substrate;

a first doped region having a first conductive type, wherein the first doped region is located in the substrate between the isolation structures;

at least two second doped regions having a second conductive type, wherein the second doped regions are located adjacent to both sides of the first doped region respectively;

at least two isolation regions located in the substrate between the first doped region and the second doped regions;

a gate structure located on the substrate between the second doped regions; and

a source/drain region having the second conductive type, wherein the source/drain region is located in the substrate adjacent to both sides of the gate structure.

2. The high voltage device of claim 1 , wherein a distance between the first doped region and one of the second doped regions is about 0.1-3 micrometers.

3. The high voltage device of claim 1 , wherein a distance between the first doped region and one of the second doped regions is about 0.5 micrometers.

4. The high voltage device of claim 1 , wherein the gate structure is located on the substrate between the isolation structures and the source/drain region is separated from the gate structure by the isolation structures.

5. The high voltage device of claim 1 , wherein when the first conductive type is P type, the second conductive type is N type.

6. The high voltage device of claim 1 , wherein when the first conductive type is N type, the second conductive type is P type.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →