IP Library Granted Patent US 7,768,364
Granted Patent B2
US 7,768,364 · App. 12/135,431 · Granted Aug 3, 2010

Bulk acoustic resonators with multi-layer electrodes

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,768,364
App. No.
12/135,431
Granted
Aug 3, 2010
Kind
B2
Abstract

Bulk acoustic resonators with multi-layer electrodes for Bulk Acoustic Wave (BAW) resonator devices. Various electrode combinations are disclosed. The invention provides a better compromise at resonant frequencies from 1800 MHz to 4 GHz in terms of keff2 and resistance than state of the art solutions using either Mo, or a bilayer of Al and W.

Claims (52)

1. A bulk acoustic wave resonator comprising:

a layer of piezoelectric material having a top and a bottom surface;

a first electrode located above the top surface of the piezoelectric layer;

a second electrode located below the bottom surface of the layer of piezoelectric material;

at least one of the first and second electrodes including at least first and second layers of material, the first layer of material being selected from the group consisting of copper and gold, and the second layer of material being tungsten;

wherein one electrode includes layers of copper and tungsten, and further comprised of a first barrier layer on a first side of the copper layer and a second barrier layer on a second side of the copper layer.

2. The bulk acoustic wave resonator of claim 1 wherein one electrode includes layers of copper and tungsten and one electrode includes layers of gold and tungsten.

3. The bulk acoustic wave resonator of claim 1 wherein one electrode includes an aluminum or aluminum alloy layer and a tungsten layer.

4. The bulk acoustic wave resonator of claim 1 wherein the first electrode includes copper and tungsten layers, and the second electrode includes a layer selected from the group consisting of Molybdenum, gold, aluminum, aluminum alloy and tungsten, or multiple layers of materials selected from the group.

5. The bulk acoustic wave resonator of claim 1 wherein both the first and second electrodes include at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten.

6. The bulk acoustic wave resonator of claim 1 wherein the resonate frequency of the bulk acoustic wave resonator is in a range from 1800 MHz to 4 GHz.

7. The bulk acoustic wave resonator of claim 1 wherein the barrier layers are selected from the group consisting of TiW, W, Ti, TiN, TaN, SiN or a combination of such layers.

8. The bulk acoustic wave resonator of claim 1 comprising a coupled resonator filter.

9. A bulk acoustic wave resonator comprising:

a layer of piezoelectric material having a top and a bottom surface;

a first electrode located above the top surface of the piezoelectric layer;

a second electrode located below the bottom surface of the layer of piezoelectric material;

at least one of the first and second electrodes including at least first and second layers of material, the first layer of material being selected from the group consisting of copper and gold, and the second layer of material being tungsten;

wherein the second electrode includes the at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten, and further comprised of a first layer of titanium tungsten (TiW) on a first side of the copper layer and a second layer of TiW on a second side of the copper layer.

10. The bulk acoustic wave resonator of claim 9 wherein the first electrode is comprised of at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten.

11. A bulk acoustic wave resonator comprising:

a layer of piezoelectric material having atop and a bottom surface;

a first electrode located above the top surface of the piezoelectric layer;

a second electrode located below the bottom surface of the layer of piezoelectric material;

at least one of the first and second electrodes including at least first and second layers of material, the first layer of material being copper, and the second layer of material being tungsten,

a first layer of titanium tungsten (TiW) on a first side of the copper layer and a second layer of TiW on a second side of the copper layer.

12. A bulk acoustic wave resonator comprising:

a layer of aluminum nitride (AlN) having a top and a bottom surface;

a first electrode located above the top surface of the AlN layer;

a second electrode located below the bottom surface of the AlN layer;

at least one of the first and second electrodes including at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten,

a first layer of titanium tungsten (TiW) on a first side of the copper layer and a second layer of TiW on a second side of the copper layer.

13. A bulk acoustic wave resonator comprising:

a layer of aluminium nitride (AlN) having a top and a bottom surface;

a first electrode located above the top surface of the AlN layer;

a second electrode located below the bottom surface of the AlN layer;

at least one of the first and second electrodes including at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten,

a first barrier layer on a first side of the copper layer and a second barrier layer on a second side of the copper layer.

14. The bulk acoustic wave resonator of claim 13 wherein one electrode includes layers of gold and tungsten.

15. The bulk acoustic wave resonator of claim 13 wherein one electrode includes an aluminum or aluminum alloy layer and a tungsten layer.

16. The bulk acoustic wave resonator of claim 13 wherein one electrode includes a layer selected from the group consisting of Molybdenum, gold, aluminum, aluminum alloy and tungsten, or multiple layers of materials selected from the group.

17. The bulk acoustic wave resonator of claim 13 wherein both the first and second electrodes include at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten.

18. The bulk acoustic wave resonator of claim 13 wherein the resonate frequency of the bulk acoustic wave resonator is in a range from 1800 MHz to 4 GHz.

19. The bulk acoustic wave resonator of claim 13 wherein the barrier layers are selected from the group consisting of TiW, W, Ti, TiN, TaN, SiN or a combination of such layers.

20. The bulk acoustic wave resonator of claim 13 comprising a coupled resonator filter.

21. A bulk acoustic wave resonator comprising:

a layer of aluminum nitride (AlN) having a top and a bottom surface;

a first electrode located above the top surface of the AlN layer;

a second electrode located below the bottom surface of the AlN layer;

at least one of the first and second electrodes including at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten;

wherein the second electrode includes at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten, and further comprised of a first layer of titanium tungsten (TiW) on a first side of the copper layer and a second layer of TiW on a second side of the copper layer.

22. The bulk acoustic wave resonator of claim 21 wherein the first electrode is comprised of at least first and second layers of material, the first layer of material being copper and the second layer of material being tungsten.

Assignments (3)
MERGER Recorded Jun 16, 2016
From: TRIQUINT SEMICONDUCTOR, INC.
To: QORVO US, INC.
Reel/Frame 039050/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2011
From: MAXIM INTEGRATED PRODUCTS, INC.
To: TRIQUINT SEMICONDUCTOR, INC.
Reel/Frame 025742/0360 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2008
From: HART, DAVID; UPPILI, SUDARSAN; BOUCHE, GUILLAUME
To: MAXIM INTEGRATED PRODUCTS, INC.
Reel/Frame 021474/0778 →