Erbium Sputtering Target and Manufacturing Method
Technology for efficiently and stably providing an erbium sputtering target with low generation of particles during sputtering and capable of achieving favorable uniformity of the sputtered film, as well as a method for manufacturing such an erbium sputtering target is provided. More specifically, an erbium sputtering target is manufactured by forging and heat treatment, wherein the target purity is 3N5 or higher, and the average grain size of crystals observed in the target structure is 1 to 20 mm. The method of manufacturing an erbium sputtering target includes the steps of subjecting a vacuum-cast ingot having a purity of 3N5 or higher to constant temperature forging within a temperature range of 1100 to 1200° C., subsequently subjecting the forged target material to heat treatment at a temperature of 800 to 1200° C., adjusting the target purity to be 3N5 or higher and the average grain size of the target structure to be 1 to 20 mm, and cutting this out to obtain a target.
1 . An erbium sputtering target manufactured by forging and heat treatment, wherein the target purity is 3N5 or higher, and the average grain size of crystals observed in the target structure is 1 to 20 mm.
2 . The erbium sputtering target according to claim 1 , wherein the average grain size is 3 to 15 mm.
3 . The erbium sputtering target according to claim 2 , wherein the uniformity of the grain size of the target in the sputtered face is within ±70%.
4 . The erbium sputtering target according to claim 2 , wherein the uniformity of the grain size of the target in the sputtered face is within ±50%.
5 . The erbium sputtering target according to claim 4 , wherein the oxygen content is 100 wtppm or less and the carbon content is 150 wtppm or less in the target.
6 . The erbium sputtering target according to claim 5 , wherein the tungsten content and the tantalum content in the target are respectively 100 wtppm or less.
7 . The erbium sputtering target according to claims 5 , wherein the tungsten content and the tantalum content in the target are respectively 20 wtppm or less.
8 . The erbium sputtering target according to anyone of claims 7 , wherein the diameter of the target is f 300 mm or greater.
9 . The erbium sputtering target according to claim 1 , wherein the uniformity of the grain size of the target in the sputtered face is within ±70%.
10 . The erbium sputtering target according to claim 1 , wherein the uniformity of the grain size of the target in the sputtered face is within ±50%.
11 . The erbium sputtering target according to claim 1 , wherein the oxygen content is 100 wtppm or less and the carbon content is 150 wtppm or less in the target.
12 . The erbium sputtering target according to claim 1 , wherein the tungsten content and the tantalum content in the target are respectively 100 wtppm or less.
13 . The erbium sputtering target according to anyone of claims 1 , wherein the tungsten content and the tantalum content in the target are respectively 20 wtppm or less.
14 . The erbium sputtering target according to anyone of claims 1 , wherein the diameter of the target is f 300 mm or greater.
15 . A method of manufacturing an erbium sputtering target, comprising the steps of:
subjecting a vacuum-cast ingot having a purity of 3N5 or higher to constant temperature forging within a temperature range of 1100 to 1200° C.;
subsequently subjecting the forged target material to heat treatment at a temperature of 800 to 1200° C.;
adjusting the target purity to be 3N5 or higher and the average grain size of the target structure to be 1 to 20 mm; and
cutting this out to obtain a target.
16 . The method of manufacturing an erbium sputtering target according to claim 15 , wherein, upon reducing and distilling erbium by mixing and heating erbium oxide as a raw material having a purity of 3N or lower with reduced metal, this is heated to a temperature of 1500 to 2500° C. to manufacture high-purity erbium having a purity of 3N5, and an ingot obtained by vacuum casting the high-purity erbium is used for manufacturing the erbium sputtering target.