Measuring board for electronic device test apparatus
View Patent ↗A performance board able to secure low loss, low reflection, stable transmission characteristics even when using a high frequency signal to test an electronic device and able to suppress signal leakage to the outside and entry of noise, provided with a base board having a signal pattern electrically connected with a socket formed on its front surface, a coaxial connector to which a coaxial cable electrically connecting the performance board and test apparatus is connected, passing through the base board from the back surface toward the front surface, and having a front exposed part of the center contact bent and electrically connected to the signal pattern, and a cover member covering the front exposed part of the center contact and correcting the impedance of the front exposed part.
1. A measurement board for electrically connecting an electronic device under test and a test apparatus, comprising:
a base board having a contactor to which the electronic device under test is to be electrically connected mounted on its front surface, and having a signal conductor interconnect electrically connected to the contactor and formed on its front surface;
a coaxial connector to which a coaxial cable electrically connecting the measurement board and the test apparatus is connected, passing through the base board from its back surface toward its front surface, and having a front exposed part of a center contact bent and electrically connected to the signal conductor interconnect; and
a cover member covering and contacting at least part of the front exposed part of the center contact, wherein
the cover member has
a first conductor interconnect arranged in parallel with a contact portion of the front exposed part which contacts the cover member and
a first dielectric arranged between the contact portion of the front exposed part and the first conductor interconnect, and
a main surface of the first conductor interconnect faces the contact portion of the front exposed part.
2. The measurement board as set forth in claim 1 , wherein
the contact portion of the front exposed part, the first conductor interconnect and the first dielectric are arranged in parallel with the front surface of the base board.
3. The measurement board as set forth in claim 2 , wherein
the first conductor interconnect is a GND pattern formed on a front surface of the first dielectric and not electrically connected with the center contact, and
the first dielectric has a thickness making an impedance of the front exposed part match impedances around the front exposed part in the center contact.
4. The measurement board as set forth in claim 2 , wherein the first dielectric is made of a material the same as the material forming the base board.
5. The measurement board as set forth in claim 1 , wherein a surface of the cover member to be soldered to the base board comprises a metal plating layer.
6. The measurement board as set forth in claim 1 , wherein
the electronic device under test is a packaged semiconductor device, and
the contactor is a socket mounted on the front surface of the base board that electrically connects to the semiconductor device.
7. The measurement board as set forth in claim 1 , wherein
the electronic device under test is a semiconductor device formed on a wafer, and
the contactor is a probe needle mounted on the front surface of the base board that electrically connects to the semiconductor device.
8. The measurement board as set forth in claim 1 , wherein
the cover member covers a bent portion of the exposed part of the center contact.