Method of manufacturing flash memory device
View Patent ↗A method of manufacturing a flash memory device that prevents generation of voids when forming an interlayer dielectric film. The method may include forming a gate on a semiconductor substrate, and then sequentially stacking a first dielectric film and a second dielectric film on the semiconductor substrate, and then forming a first spacer comprising a first dielectric film pattern and a second dielectric film pattern on sidewalls of the gate by performing a first etching process, and then forming source and drain areas in the semiconductor substrate, and then removing the second dielectric film, and then sequentially stacking a third dielectric film and a fourth dielectric film on the semiconductor substrate, and then forming a second spacer comprising the first dielectric pattern and a third dielectric pattern on the sidewalls of the gate by performing a second etching process, and then forming an interlayer dielectric film on the semiconductor substrate including the gate and the first spacer.
1. A method comprising:
forming a gate on a semiconductor substrate; and then
sequentially stacking a first dielectric film and a second dielectric film on the semiconductor substrate; and then
forming a first spacer comprising a first dielectric film pattern and a second dielectric film pattern on sidewalls of the gate by performing a first etching process; and then
forming source and drain areas in the semiconductor substrate; and then
removing the second dielectric film; and then
sequentially stacking a third dielectric film and a fourth dielectric film on the semiconductor substrate; and then
forming a second spacer comprising the first dielectric pattern and a third dielectric pattern on the sidewalls of the gate by performing a second etching process, wherein forming the second spacer comprises performing the second etching process removing a portion of the third dielectric film and the entire fourth dielectric film; and then
forming an interlayer dielectric film on the semiconductor substrate including the gate and the first spacer.
2. The method of claim 1 , wherein removing the second dielectric pattern comprises:
removing the second dielectric film pattern by performing a wet etching process.
3. The method of claim 2 , wherein the wet etching process is performed using phosphoric acid (H 3 PO 4 ) as an etching solution.
4. The method of claim 1 , wherein the first and fourth dielectric films comprise an oxide film and the second and third dielectric films comprise a nitride film.
5. The method of claim 4 , wherein the oxide film comprises TEOS and the nitride film comprises SiN.
6. The method of claim 1 , wherein sequentially stacking the first dielectric film and the second dielectric film comprises:
sequentially forming the first dielectric film having a thickness in a range between 100 to 300 Å and the second dielectric film having a thickness in a range between 500 to 800 Å.
7. The method of claim 1 , wherein sequentially stacking the third dielectric film and the fourth dielectric film comprises:
forming the third dielectric film having a thickness in arrange between 70 to 200 Å and the fourth dielectric film having a thickness in a range between 360 to 440 Å.
8. The method of claim 1 , wherein forming the gate includes sequentially stacking a gate oxide film, a floating gate, a dielectric film and a control gate on the semiconductor substrate.
9. The method of claim 1 , further comprising, after forming the second spacer and before forming the interlayer dielectric film:
forming a metal layer on the semiconductor substrate including the gate and the second spacer; and then
forming a silicide layer on the gate and the source/drain area by performing an annealing process on the semiconductor substrate.
10. The method of claim 9 , wherein the metal layer comprises cobalt.
11. A method comprising:
forming a plurality of gates in a cell area of a semiconductor substrate and a gate electrode in a peripheral area of the semiconductor substrate; and then
forming first spacers comprising a first dielectric layer and a second dielectric layer on sidewalls of the gates and the gate electrode; and then
forming source/drain areas in the semiconductor substrate; and then
removing the second dielectric layer to expose the first dielectric layer; and then
forming second spacers comprising the first dielectric layer and a third dielectric layer on the sidewalls of the gate and the gate electrode, wherein performing the second etching process comprises removing a portion of the third dielectric film and the entire fourth dielectric film.
12. The method of claim 11 , wherein forming the first spacers comprises:
forming the first dielectric film against sidewalls of the gate and the gate electrode and on the uppermost surface of the semiconductor substrate; and then
forming the second dielectric film on the first dielectric film; and then
performing a first etching process on the first dielectric film and the second dielectric film.
13. The method of claim 11 , wherein forming the second spacers comprises:
forming the third dielectric film on the first dielectric film; and then
forming a fourth dielectric film on the third dielectric film; and then
performing a second etching process on the third dielectric film and the fourth dielectric film.
14. The method of claim 11 , further comprising, after forming the second spacers:
forming silicide layers on the gates, the gate electrodes and the source/drain areas; and then
forming an interlayer dielectric film on the semiconductor substrate including the gates, the gate electrode, the silicide layers and the second spacers; and then
forming a contact plug extending through the interlayer dielectric film and electrically connected to the gates, the gate electrode and the source/drain areas.
15. The method of claim 14 , wherein forming the silicide layer comprises:
forming a first metal layer on the semiconductor substrate including the gates, the gate electrode and the second spacers; and then
performing an annealing process on the semiconductor substrate.
16. The method of claim 15 , wherein forming the contact plugs comprises:
forming via holes in the interlayer dielectric film exposing the silicide layers; and then
forming a second metal layer in the via holes.
17. The method of claim 16 , wherein the first metal layer comprises cobalt and the second metal layer comprises tungsten.
18. A method comprising:
forming gates spaced apart on a semiconductor substrate; and then
forming first spacers comprising a first oxide layer and a first nitride layer on sidewalls of the gates; and then
forming source/drain areas in the semiconductor substrate; and then
removing the first nitride layer to expose the first oxide layer; and then
forming second spacers comprising the first oxide layer and a second nitride layer on the sidewalls of the gate, wherein performing the second etching process comprises removing a portion of the third dielectric film and the entire fourth dielectric film; and then
forming silicide layers on the gates and the source/drain areas; and then
forming an interlayer dielectric film on the semiconductor substrate including the gates, the silicide layers and the second spacers; and then
forming a contact plug extending through the interlayer dielectric film and electrically connected to the gates, the gate electrode and the source/drain areas.