Method of isolating semiconductor laser diodes
View Patent ↗Provided is a method of isolating semiconductor laser diodes (LDs), the method including the steps of: preparing a substrate; forming a plurality of semiconductor LDs on the substrate, each semiconductor LD including an n-type semiconductor layer, an active layer, a p-type semiconductor layer, an n-electrode, a ridge portion, and a p-electrode, the ridge portion being formed by etching the p-type semiconductor layer such that a portion of the p-type semiconductor layer protrudes, the p-electrode being formed on the ridge portion; partially forming base cut lines on the surface of the substrate excluding the ridge portions; and isolating the semiconductor LDs into a bar shape along the base cut lines.
1. A method of isolating semiconductor laser diodes (LDs), comprising the steps of:
preparing a substrate;
forming a plurality of semiconductor LDs on the substrate, each semiconductor LD including an n-type semiconductor layer, an active layer, a p-type semiconductor layer, an n-electrode, a ridge portion, and a p-electrode, the ridge portion being formed by etching the p-type semiconductor layer such that a portion of the p-type semiconductor layer protrudes, the p-electrode being formed on the ridge portion;
partially forming base cut lines on the surface of the substrate excluding the ridge portions; and
isolating the semiconductor LDs into a bar shape along the base cut lines,
wherein a cut region having the base cut lines formed on the surface of the substrate occupies more than 75% of the overall region composed of the cut region and an uncut region where the base cut line is not formed, and
wherein a ratio of the cut region to the uncut region is 3:1.
2. A method of isolating semiconductor LDs, comprising the steps of:
preparing a substrate;
forming a plurality of semiconductor LDs with a ridge portion on the substrate; and
partially forming base cut lines on the surface of the substrate excluding the ridge portions,
wherein a cut region having the base cut lines formed on the surface of the substrate is three times longer than that of an uncut region where the base cut line is not formed, and
wherein a ratio of the cut region to the uncut region is 3:1.
3. The method according to claim 1 , wherein in the isolating of the semiconductor LDs, stress is applied to the base cut line by repeatedly scribing a line along the base cut line.
4. The method according to claim 1 , wherein in the preparing of the substrate, the substrate is formed of a sapphire substrate or GaN substrate.
5. The method according to claim 1 further comprising the step of:
cutting the bar-shaped semiconductor LD in a direction perpendicular to the base cut line such that the semiconductor LD is divided into a plurality of pieces.
6. The method according to claim 3 , wherein the base cut line is formed using a diamond knife.
7. The method according to claim 2 further comprising the step of:
isolating the semiconductor LDs by repeatedly scribing a line along the base cut lines using a knife for forming the base cut lines.
8. The method according to claim 7 , wherein the line is scribed more than two times.