Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device
A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
1 . A manufacturing method of a semiconductor device, comprising:
a first exposing and printing step of forming a first exposed and printed area on a semiconductor substrate using a reticle having a pattern corresponding to a plurality of semiconductor elements that are separated by a first scribe line;
a second exposing and printing step of forming a second exposed and printed area on said semiconductor substrate so that a second scribe line extends between said first exposed and printed area and said second exposed and printed area, which has a width larger than a width of said first scribe line; and
a step of individualizing the semiconductor elements by cutting and separating said semiconductor substrate along said first scribe line and said second scribe line.
2 . The manufacturing method as claimed in claim 1 , further comprising setting the width of said first scribe line to a minimum width by which said semiconductor substrate can be cut.
3 . A testing method of a semiconductor device in which a plurality of semiconductor element areas are formed on a semiconductor substrate by forming a plurality of unit exposed and printed areas including a first unit exposed and printed area and a second unit exposed and printed area each of which contains the semiconductor element areas, the testing method comprising:
simultaneously testing the semiconductor elements located at corresponding positions in the first unit exposed and printed area and the second unit exposed and printed area.
4 . The testing method as claimed in claim 3 , further comprising correcting a position at which an electric contact is made to the semiconductor element area within said second exposed and printed area in accordance with a positional error between said first exposed and printed area and said second exposed and printed area.