Fabrication system and fabrication method
View Patent ↗A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of processing is monitored. In the processing, a first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus is transported toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus, according to the managing information.
1. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber and an interface for loading and unloading a plurality of semiconductor wafers contained in a carrier, an inter-apparatus transporter, a first computer storing managing information of processing of the semiconductor wafers with the at least first and second processing apparatuses, and a second computer storing managing information of transporting of the semiconductor wafers with the inter-apparatus transporter, a method for processing semiconductor wafers comprising the steps of:
processing a plurality of the semiconductor wafers contained in a first carrier by the first processing apparatus with a first predetermined process parameter according to the managing information of processing;
monitoring a result of processing in the first processing apparatus;
transporting said first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus according to the managing information of transporting; and
processing a plurality of the semiconductor wafers contained in the first carrier by the second processing apparatus with a second predetermined parameter according to the managing information of processing;
wherein the second predetermined process parameter in the second processing apparatus is adjusted in view of the monitored result of processing in the first processing apparatus.
2. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber and an interface for loading and unloading a plurality of semiconductor wafers contained in a carrier, an inter-apparatus transporter, and at least one computer storing managing information of processing of the semiconductor wafers with the at least first and second processing apparatuses and managing information of transporting of the semiconductor wafers with the inter-apparatus transporter, a method for processing semiconductor wafers comprising the steps of:
processing a plurality of the semiconductor wafers contained in a first carrier by the first processing apparatus with a first predetermined process parameter according to the managing information of processing;
monitoring a state of processing in the first processing apparatus;
transporting said first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus according to the managing information of transporting; and
processing a plurality of the semiconductor wafers contained in the first carrier by the second processing apparatus with a second predetermined parameter according to the managing information of processing;
wherein the second predetermined process parameter in the second processing apparatus is adjusted in view of the monitored state of processing in the first processing apparatus.
3. A fabricating method for a fabricating system including at least first and second processing apparatuses each being provided with at least a processing chamber and an interface for loading and unloading a plurality of semiconductor wafers contained in a carrier, an inter-apparatus transporter, a first computer storing managing information of processing of the semiconductor wafers with the at least first and second processing apparatuses, and a second computer storing managing information of transporting of the semiconductor wafers with the inter-apparatus transporter, a method for processing semiconductor wafers comprising the steps of:
processing a plurality of the semiconductor wafers contained in a first carrier by the first processing apparatus with a first predetermined process parameter according to the managing information of processing;
monitoring a state of processing in the first processing apparatus;
transporting said first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus according to the managing information of transporting; and
processing a plurality of the semiconductor wafers contained in the first carrier by the second processing apparatus with a second predetermined parameter according to the managing information of processing;
wherein the second predetermined process parameter in the second processing apparatus is adjusted in view of the monitored state of processing in the first processing apparatus.