IP Library Granted Patent US 8,426,880
Granted Patent B2
US 8,426,880 · App. 12/155,877 · Granted Apr 23, 2013

Semiconductor light emitting device and method of manufacturing the same

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Quick Facts
Patent No.
US 8,426,880
App. No.
12/155,877
Granted
Apr 23, 2013
Kind
B2
Abstract

There are provided a semiconductor light emitting device that can be manufactured by a simple process and has excellent light extraction efficiency and a method of manufacturing a semiconductor light emitting device that has high reproducibility and high throughput. A semiconductor light emitting device having a substrate and a lamination in which a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer are sequentially laminated onto the substrate according to an aspect of the invention includes a silica particle layer; and an uneven part formed at a lower part of the silica particle layer.

Claims (18)

1. A semiconductor light emitting device, comprising:

a substrate having an uneven surface, the uneven surface having convex portions;

a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, which are sequentially laminated onto the uneven surface of the substrate; and

a silica particle layer having a plurality of silica particles disposed only on convex portions of the uneven surface, wherein:

the silica particles are directly in contact with the convex portions of the uneven surface,

the silica particle layer is a monolayer to reflect light from the active layer,

the plurality of silica particles have a spherical shape, and

the convex portions have a cylindrical shape.

2. The semiconductor light emitting device of claim 1 , wherein the substrate is any one of a sapphire substrate, a GaN substrate, a SiC substrate, and a ZnO substrate.

3. The semiconductor light emitting device of claim 1 , wherein at least one of the silica particles has a diameter in the range of 100 to 1000 nm.

4. The semiconductor light emitting device of claim 1 , wherein:

the silica particle layer is disposed between the substrate and the first conductivity type semiconductor layer, and

the uneven surface is defined on the surface of the substrate.

5. The semiconductor light emitting device of claim 1 , wherein:

the uneven surface includes concave portions, and

the concave portions and the convex portion are alternately disposed to define the uneven surface.

6. The semiconductor light emitting device of claim 1 , wherein sizes of the silica particles are less than or the same as the wavelength of the light from the active layer.

7. The semiconductor light emitting device of claim 1 , wherein the silica particles have a lower refractive index than a refractive index of the active layer.

Assignments (2)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →