Partitioning of electronic packages
Partitioning electronic sensor packages is provided. The electronic sensor package includes an electronic component, a sensor device, and electrical connections between the electronic component and the sensor device. A dam is written in the electronic sensor package to partition the package into two or more sections, where the sensor device is situated at least partially in one section and the electronic component is situated at least partially in another section. The partitioning of the dam allows the two sections to be filled with different fill materials. For example, the section with the sensor device can be filled with a soft gel-like material to provide some moisture protection to the sensor device without causing detrimental stresses to the sensor device, while the section with the electronic component can be filled with a highly moisture protective epoxy.
1. An electronic sensor package, comprising:
(a) an electronic component;
(b) a sensor device, wherein said sensor device comprises a working component for sensing a condition external to said sensor device;
(c) one or more electrical connectors, wherein said one or more electrical connectors connect said electronic component and said sensor device; and
(d) a dam, wherein said dam is written to partition said electronic sensor package into at least a first section and a second section, wherein said sensor device is situated at least partially in said first section, wherein said electronic component is situated at least partially in said second section, wherein said first section is at least partially filled with a first fill material, wherein said second section is at least partially filled with a second fill material, and wherein said first fill material is different from said second fill material;
wherein said electronic component and said sensor device are laterally separated from each other.
2. The electronic sensor package as set forth in claim 1 , wherein said sensor device is situated exclusively in said first section.
3. The electronic sensor package as set forth in claim 1 , wherein said sensor device has a top and a bottom, wherein said one or more electrical connectors are connected to said top of said sensor device, and wherein said working component is positioned on said bottom of said sensor device.
4. The electronic sensor package as set forth in claim 1 , wherein said one or more electrical connectors is situated exclusively within either said first section or said second section.
5. The electronic sensor package as set forth in claim 1 , wherein said one or more electrical connectors comprises a wirebond, a flip chip connector, a TAB connector or any combination thereof.
6. The electronic sensor package as set forth in claim 1 , further comprising a premolded cavity package having opposing walls, wherein said electronic component and said sensor device are positioned inside said premolded cavity package, and wherein said dam is written from one of said walls to another of said walls of said premolded cavity package.
7. The electronic sensor package as set forth in claim 1 , further comprising a circuit board, wherein said electronic component and said sensor device are mounted onto said circuit board, and wherein a perimeter of at least one of said sections is defined by said dam.
8. The electronic sensor package as set forth in claim 1 , wherein said dam is written across a surface of non-uniform heights, and wherein the top of said dam is approximately uniformly level.
9. The electronic sensor package as set forth in claim 1 , further comprising a lid, wherein said lid is positioned on top of said first and said second fill materials.
10. The electronic sensor package as set forth in claim 1 , further comprising a third fill material, wherein said third fill material overflows said dam.
11. The electronic sensor package as set forth in claim 1 , wherein said first fill material comprises a gel, a low stress elastomer, a fluid, a low modulus material, or any mixture thereof.
12. The electronic sensor package as set forth in claim 1 , wherein said second fill material comprises an epoxy material, a silicone rubber material, an elastomer, a urethane material, a potting compound, a thermoset polymer, or any mixture thereof.
13. The electronic sensor package as set forth in claim 1 , wherein said sensor device comprises a pressure sensor, a temperature sensor, an acceleration sensor, a gyroscope, an optical sensor, a proximity sensor, a magnetic sensor, a current sensor, a stress sensor, a torque sensor, or any combination thereof.