Multi-package slot array
View Patent ↗A multi-package module that includes a multi-layer interconnect structure, a housing structure attached to the multi-layer interconnect structure, and a plurality of integrated circuit packages inserted into slots in the housing structure, and placed into contact with the multi-layer interconnect structure. The integrated circuit packages can be removed from the slots in the housing structure, thereby enabling testing and/or replacement of the integrated circuit packages.
1. A multi-package module comprising:
an interconnect structure having a plurality of interconnect terminals located over a first surface thereof;
a housing structure attached to the interconnect structure, the housing structure having plurality of slots through which the interconnect terminals are exposed;
a plurality of integrated circuit packages, each having a first set of contact terminals located along a first surface thereof, wherein each of the integrated circuit packages is positioned within a corresponding one of the slots of the housing structure, such that the first set of contact terminals of each integrated circuit package are in contact with a corresponding set of the interconnect terminals of the interconnect structure, and wherein the first surface of each of the integrated circuit packages is perpendicular to the first surface of the interconnect structure; and
a fan module located in a slot of the housing structure, wherein the fan module includes a fan that directs an airflow over the integrated circuit modules.
2. The multi-package module of claim 1 , wherein the slot containing the fan module is positioned orthogonal to the slots containing the integrated circuit packages.
3. The multi-package module of claim 1 , wherein the slot containing the fan module is positioned parallel to the slots containing the integrated circuit packages.
4. A multi-package module comprising:
an interconnect structure having a plurality of interconnect terminals exposed at an upper surface thereof;
a housing structure having a lower surface and an opposing upper surface, wherein the lower surface of the housing structure is attached to the upper surface of the interconnect structure, the housing structure having a plurality of slots through which the interconnect terminals are exposed, wherein each of the slots extends from the lower surface to the opposing upper surface of the housing structure;
a plurality of integrated circuit packages, each having a first set of contact terminals located along a first surface thereof, wherein each of the integrated circuit packages is positioned within a corresponding one of the slots of the housing structure, such that the first set of contact terminals of each integrated circuit package are in contact with a corresponding set of the interconnect terminals of the interconnect structure, and wherein the first surface of each of the integrated circuit packages is perpendicular to the upper surface of the interconnect structure;
a lid removably attached to the housing structure, wherein the lid extends over the slots in the housing structure, thereby retaining the integrated circuit packages in the slots; and
spring-loaded elements located between the lid and the integrated circuit packages, wherein the spring-loaded elements force the integrated circuit packages into the slots.