IP Library Granted Patent US 9,123,395
Granted Patent B2
US 9,123,395 · App. 12/169,595 · Granted Sep 1, 2015

Stack bank type semiconductor memory apparatus capable of improving alignment margin

Inventors: Seung-Wook Kwak (Ichon, KR); Sang-Hoon Shin (Ichon, KR); Keun-Soo Song (Ichon, KR)
Assignee: SK hynix Inc.
G11C5/063G11C5/025
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Quick Facts
Patent No.
US 9,123,395
App. No.
12/169,595
Granted
Sep 1, 2015
Kind
B2
Abstract

A semiconductor memory apparatus is capable of improving the alignment margin for a bank and sufficiently ensuring a space for forming a global input/output line. The semiconductor memory apparatus includes a stack bank structure having at least two sub-banks continuously stacked without disconnection of data signal lines, and a control block arranged at one side of the stack bank structure to simultaneously control column-related signals of the sub-banks.

Claims (33)

1. A semiconductor memory apparatus, comprising:

a stack bank structure having at least two sub-banks continuously stacked;

a plurality of signal lines disposed on the stack bank structure to be electrically coupled to a column control block; and

a share block arranged between the sub-banks, wherein

the plurality of signal lines are shared by each of the sub-banks included in the stack bank structure and are arranged on the stack bank structure without electrical disconnection between the sub-banks, and

the share block includes a predecoder and a fuse set.

2. The semiconductor memory apparatus of claim 1 , wherein

the column control block is arranged at one side of the stack bank structure to simultaneously receive control signals for controlling column lines of the sub-banks included in the stack bank structure, and

the column control block is shared by each of the sub-banks included in the stack bank structure.

3. The semiconductor memory apparatus of claim 2 , wherein the column control block includes a decoding block to decode the signals.

4. The semiconductor memory apparatus of claim 3 , wherein the decoding block includes a main decoder and a predecoder.

5. The semiconductor memory apparatus of claim 2 , wherein

the column control block includes an address controller and an Input/Output controller,

the address controller is arranged between the sub banks, and

the Input/Output controller is arranged at one side of the stack bank structure.

6. The semiconductor memory apparatus of claim 1 , wherein the sub-bank includes a mat array having a plurality of mat rows and a plurality of mat columns, and wherein the predecoder and the fuse set are alternately arranged in the share block based on an arrangement of the mat rows.

7. The semiconductor memory apparatus of claim 6 , wherein a pair of local input/output lines are arranged between the mat rows, respectively, and wherein the share block further comprises a precharge unit arranged between the predecoder and the fuse set based on an arrangement of the local input/output lines.

8. The semiconductor memory apparatus of claim 7 , wherein the precharge unit receives precharge signals from a precharge controller arranged at a peripheral area.

9. The semiconductor memory apparatus of claim 6 , further comprising a precharge unit interposed between the predecoder and the fuse set in the share block.

10. The semiconductor memory apparatus of claim 1 , further comprising a main decoder interposed between the share block and the sub-bank.

11. A semiconductor memory apparatus, comprising:

a stack bank structure having at least two sub-banks continuously stacked, at least one of the sub-banks including a plurality of mats;

a plurality of signal lines disposed on the stack bank structure to be electrically coupled to a column control block; and

a share block disposed between the sub-banks, wherein

the plurality of signal lines are shared by each of the sub-banks included in the stack bank structure and are arranged on the stack bank structure without electrical disconnection between the sub-banks, and

the share block includes a predecoder and a fuse set.

12. The semiconductor memory apparatus of claim 11 , wherein

the plurality of the mats are arranged to include a plurality of mat rows and a plurality of mat columns, and

the predecoder and the fuse set are alternately arranged in the share block based on an arrangement of the mat rows.

13. The semiconductor memory apparatus of claim 12 , wherein

a pair of local input/output signal lines are arranged between the mat rows, respectively, and

the share block further comprises a precharge unit arranged between the predecoder and the fuse set based on an arrangement of the local input/output signal lines.

14. The semiconductor memory apparatus of claim 13 , wherein the precharge unit receives precharge signals from a precharge controller arranged at a peripheral area.

Assignments (2)
CHANGE OF NAME Recorded Sep 2, 2016
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 039902/0080 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 13, 2008
From: KWAK, SEUNG WOOK; SHIN, SANG HOON; SONG, KEUN SOO
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 021381/0483 →
Priority Claims (3)
KR 10-2007-0114146 · Nov 9, 2007 · national
KR 10-2007-0114944 · Nov 12, 2007 · national
KR 10-2007-0115462 · Nov 13, 2007 · national
Continuity (1)
Related Publication 20090122632A1 · May 14, 2009