Method for manufacturing thermal interface material having carbon nanotubes

1. A method for manufacturing a thermal interface material, the method comprising the steps of:

(a) providing a carbon nanotube array formed on a substrate, the carbon nanotube array comprising a plurality of carbon nanotubes and a plurality of interstices between the adjacent carbon nanotubes;

(b) filling a liquid state first base material into the interstices;

(c) curing the first base material by cooling the first base material to room temperature to solidify the first base material, thereby achieving a carbon nanotube/first base material composite;

(d) dripping a liquid state second base material onto a surface of the carbon nanotube/first base material composite, the first base material melting due to a temperature of the liquid state second base material being higher than a melting point temperature of the first base material, and the liquid state first base material flowing out of the carbon nanotube/first base material composite until the carbon nanotube array is substantially submerged in the second base material; and

(e) curing the second base material by cooling the second base material to room temperature to solidify the second base material, thereby achieving a thermal interface material.

2. The method for manufacturing a thermal interface material as claimed in claim 1 , wherein in step (a), the carbon nanotubes in the carbon nanotube array are substantially parallel to each other and substantially perpendicular to the substrate.

3. The method for manufacturing a thermal interface material as claimed in claim 1 , wherein in step (b), the liquid state first base material is filled into the interstices by immersing the carbon nanotube array into a melt or solution of the first base material or by injecting.

4. The method for manufacturing a thermal interface material as claimed in claim 1 , wherein a step of treating the first base material and the carbon nanotube array is further provided before step (c), and the step is executed by an ultrasonic process to remove the air in the interstices.

5. The method for manufacturing a thermal interface material as claimed in claim 1 , wherein in step (c), the liquid state first base material is cured by a cool hardening method or an ultraviolet curing method.

6. The method for manufacturing a thermal interface material as claimed in claim 1 , wherein the second base material has a higher melting point than the first base material.

7. The method for manufacturing a thermal interface material as claimed in claim 1 , wherein the second base material is selected from the group consisting of indium, copper, titanium and any alloy thereof.

8. The method for manufacturing a thermal interface material as claimed in claim 1 , wherein the substrate is made from a material selected from the group consisting of glass, silicon, and metal.

9. The method for manufacturing a thermal interface material as claimed in claim 1 , wherein the first base material is a macromolecular material or a phase change material.

10. The method for manufacturing a thermal interface material as claimed in claim 9 , wherein the macromolecular material is selected from the group consisting of silicone, polyester, polyvinyl chloride (PVC), polyvinyl alcohol (PVA), polyethylene, polypropylene, epoxy resin, polycarbonate (PC), polyoxymethylene, and polyacetal.

11. The method for manufacturing a thermal interface material as claimed in claim 9 , wherein the phase change material is selected from the group consisting of paraffin and polyolefin.

12. The method for manufacturing a thermal interface material as claimed in claim 1 , further comprising a step of etching two opposite surfaces of the thermal interface material after step (e), wherein the two opposite surfaces are substantially perpendicular to a long-axis of each of the carbon nanotubes.

13. The method for manufacturing a thermal interface material as claimed in claim 12 , wherein the etching step is performed by a wet etching method, or by a dry etching method.

14. A method for manufacturing a thermal interface material, comprising the steps of:

(a) providing a device, the device being a hollow member that defines an inner space, wherein the device comprises a sidewall and at least one through hole, the sidewall comprises an upper opening and a lower opening, and the at least one through hole is defined in the sidewall adjacent to the lower opening;

(b) providing a carbon nanotube array formed on a substrate, the carbon nanotube array comprising a plurality of carbon nanotubes and a plurality of interstices between the adjacent carbon nanotubes;

(c) arranging the carbon nanotube array with the substrate into the inner space of the device, the lower opening being in contact with and corresponding to the substrate;

(d) filling a liquid state first base material into the interstices via the upper opening;

(e) curing the first base material by cooling the first base material to room temperature to solidify the first base material, thereby achieving a carbon nanotube/first base material composite;

(f) dripping a liquid state second base material onto a surface of the carbon nanotube/first base material composite via the upper opening, the first base material melting due to a temperature of the liquid state second base material being higher than a melting point temperature of the first base material, and the liquid state first base material leaking through the at least one through hole until the carbon nanotube array is substantially submerged in the second base material; and

(g) curing the second base material by cooling the second base material to room temperature to solidify the second base material, thereby achieving a thermal interface material.

15. The method for manufacturing a thermal interface material as claimed in claim 14 , wherein a long-axis of each of the carbon nanotubes of the carbon nanotube array is substantially parallel to the sidewall of the device.