IP Library Granted Patent US 7,919,768
Granted Patent B2
US 7,919,768 · App. 12/172,162 · Granted Apr 5, 2011

Phase-change memory element

Assignee: Industrial Technology Research Institute
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Quick Facts
Patent No.
US 7,919,768
App. No.
12/172,162
Granted
Apr 5, 2011
Kind
B2
Abstract

A phase-change memory cell is proposed. The phase-change memory includes a bottom electrode; a phase-change spacer formed to contact the bottom electrode; an electrical conductive layer having a vertical portion and a horizontal portion, wherein the electrical conductive layer electrically connects to the phase-change spacer via the horizontal portion; and a top electrode electrically connected to the electrical conductive layer via the vertical portion of the electrically conductive layer.

Claims (14)

1. A phase-change memory element, comprising:

a bottom electrode;

a phase-change spacer formed to contact the bottom electrode;

an electrically conductive layer having a vertical portion and a horizontal portion, wherein the electrically conductive layer electrically connects to the phase-change spacer via the horizontal portion; and

a top electrode electrically connected to the electrical conductive layer via the vertical portion of the electrically conductive layer.

2. The phase-change memory element as claimed in claim 1 , wherein the bottom electrode is separated from the electrical conductive layer by a dielectric layer.

3. The phase-change memory element as claimed in claim 1 , wherein the thickness of the horizontal portion of the electrically conductive layer is 10˜100 nm.

4. The phase-change memory element as claimed in claim 1 , wherein the top electrode does not contact with the phase-change spacer.

5. The phase-change memory element as claimed in claim 1 , wherein the phase-change spacer comprises In, Ge, Sb, Te, Ga, Sn or combinations thereof.

6. The phase-change memory element as claimed in claim 1 , wherein the electrically conductive layer comprises a transition metal, aluminum, silicon, aluminum nitride, a transition metal nitride, or combinations thereof.

7. The phase-change memory element as claimed in claim 1 , wherein the top and bottom electrodes respectively comprise a transition metal, aluminum, silicon, aluminum nitride, a transition metal nitride, or combinations thereof.

8. The phase-change memory element as claimed in claim 1 , wherein the phase-change spacer directly contacts with at least one of the top surface and the side-wall of the horizontal portion of the electrically conductive layer.

9. The phase-change memory element as claimed in claim 1 , wherein the phase-change spacer is L-shaped, I-shaped, or ladder-shaped.

10. The phase-change memory element as claimed in claim 1 , wherein the electrical conductive layer is L-shaped, I-shaped, or ladder-shaped.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2026
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: HIGGS OPL. CAPITAL LLC
Reel/Frame 075733/0186 →
MERGER Recorded Dec 26, 2015
From: HIGGS OPL. CAPITAL LLC
To: GULA CONSULTING LIMITED LIABILITY COMPANY
Reel/Frame 037360/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2011
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: HIGGS OPL. CAPITAL LLC
Reel/Frame 027364/0397 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2010
From: POWERCHIP SEMICONDUCTOR CORP.; NANYA TECHNOLOGY CORPORATION; PROMOS TECHNOLOGIES INC.; WINBOND ELECTRONICS CORP.
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 024149/0102 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2008
From: CHEN, FREDERICK T; TSAI, MING-JINN
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE; POWERCHIP SEMICONDUCTOR CORP.; NANYA TECHNOLOGY CORPORATION; PROMOS TECHNOLOGIES INC.; WINBOND ELECTRONICS CORP.
Reel/Frame 021240/0165 →
Continuity (1)
Related Publication 20100006814A1 · Jan 14, 2010