Light emitting diode package
View Patent ↗A light emitting diode (LED) package includes a first serial array of light emitting cells formed on a first substrate to emit light of a relatively short wavelength, and a second serial array of light emitting cells formed on a second substrate to emit light of a relatively long wavelength. The first and second serial arrays are connected to in reverse parallel. The LED package is capable of being operated under AC power and emitting white light with excellent color reproduction characteristics and luminous efficiency.
1. A light emitting diode (LED) package, comprising:
a first serial array comprising light emitting cells of a first type but not a second type arranged on a first substrate to emit light of a relatively short wavelength; and
a second serial array comprising light emitting cells of the second type but not the first type arranged on a second substrate to emit light of a relatively long wavelength,
wherein the first serial array and the second serial array are connected in reverse parallel.
2. The LED package as claimed in claim 1 , further comprising:
a phosphor to wavelength-convert at least a portion of the light emitted from the first serial array.
3. The LED package as claimed in claim 2 , wherein the light emitting cells in the first serial array emit blue light, the light emitting cells in the second serial array emit red light, and the phosphor wavelength-converts the blue light into green light.
4. The LED package as claimed in claim 3 , further comprising:
a molding member covering the first serial array and the second serial array,
wherein the molding member comprises a diffusing agent.
5. The LED package as claimed in claim 2 , wherein the light emitting cells in the first serial array emit blue light, the light emitting cells in the second serial array emit green light, and the phosphor wavelength-converts blue light into red light.
6. The LED package as claimed in claim 5 , further comprising:
a molding member covering the first serial array and the second serial array,
wherein the molding member comprises a diffusing agent.
7. The LED package as claimed in claim 1 , wherein
each light emitting cell in the first serial array comprises:
a first conductive-type semiconductor layer,
a second conductive-type semiconductor layer, and
a first active layer interposed therebetween;
each light emitting cell in the second serial array comprises:
a first conductive-type semiconductor layer,
a second conductive-type semiconductor layer, and
a second active layer interposed therebetween,
and
the first active layer is formed of an AIInGaN-based compound, and the second active layer is formed of an AIInGaP-based compound.
8. The LED package as claimed in claim 1 , wherein a first bonding pad is disposed at an end of the first serial array and a second bonding pad is disposed at an end of the second serial array.
9. The LED package as claimed in claim 1 , further comprising a third serial array comprising light emitting cells emitting light of a wavelength different from the first serial array and the second serial array,
wherein the third serial array is connected in series or in parallel to the first serial array and the second serial array.