IP Library Granted Patent US 7,687,818
Granted Patent B2
US 7,687,818 · App. 12/177,517 · Granted Mar 30, 2010

Semiconductor light emitting device

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Quick Facts
Patent No.
US 7,687,818
App. No.
12/177,517
Granted
Mar 30, 2010
Kind
B2
Abstract

There is provided a semiconductor light emitting device having excellent light extraction efficiency to efficiently reflect light moving into the device by increasing the total reflectivity of a reflective layer. A semiconductor light emitting device according to an aspect of the invention includes: a substrate, a reflective electrode, a first conductivity semiconductor layer, an active layer, and a second conductivity type semiconductor layer that are sequentially stacked. Here, the reflective electrode includes; a first reflective layer provided on the substrate and including a conductive reflective material reflecting light generated from the active layer; and a second reflective layer provided on the first reflective layer, including one or more dielectric portions reflecting light generated from the active layer, and one or more contact holes filled with a conductive filler to electrically connect the first conductivity type semiconductor layer and the first reflective layer, and having a greater thickness than a wavelength of the generated light.

Claims (17)

1. A semiconductor light emitting device comprising:

a substrate;

a stack having a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer sequentially stacked on the substrate; and

a reflective electrode provided between the substrate and the stack to reflect light generated from the active layer, the reflective electrode comprising;

a first reflective layer provided on the substrate and including a conductive reflective material reflecting light generated from the active layer; and

a second reflective layer provided on the first reflective layer, including one or more dielectric portions reflecting light generated from the active layer, and one or more contact holes filled with a conductive filler to electrically connect the first conductivity type semiconductor layer and the first reflective layer, and having a greater thickness than a wavelength of the generated light.

2. The semiconductor light emitting device of claim 1 , wherein the conductive reflective material is Ag or Al.

3. The semiconductor light emitting device of claim 1 , wherein the first reflective layer includes Ni at a partial or entire surface thereof.

4. The semiconductor light emitting device of claim 3 , wherein the Ni content is 10 wt % of the total weight of the first reflective layer.

5. The semiconductor light emitting device of claim 1 , wherein the dielectric portions each have a thickness of 2 μm or less.

6. The semiconductor light emitting device of claim 1 , wherein the dielectric portions each have a lower refractive index than the second conductivity type semiconductor layer.

7. The semiconductor light emitting device of claim 1 , wherein the dielectric portions each are SiO 2 or SiN.

8. The semiconductor light emitting device of claim 1 , further comprising a second conductivity type electrode on the second conductivity type semiconductor layer,

wherein any one of the dielectric portions is located at a region of the second reflective layer, the region underlying the second conductivity type electrode.

9. The semiconductor light emitting device of claim 8 , wherein any one of the dielectric portions has an area equal to or greater than the second conductivity type electrode.

10. The semiconductor light emitting device of claim 1 , wherein the conductive filler filling in the contact holes is the same material as the conductive reflective material.

11. The semiconductor light emitting device of claim 1 , wherein the substrate is a conductive substrate including any one of Ni, Cu, and Si.

Assignments (3)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2008
From: YOON, SANG HO; LEE, SU YEOL; BAIK, DOO GO; CHOI, SEOK BEOM; JANG, TAE SUNG; WOO, JONG GUN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 021273/0138 →