Devices for fabricating tri-layer beams

1. A multilayer structure for a micro electro-mechanical device, comprising:

a substrate;

a beam spaced apart from the substrate by a gap, the beam comprising:

an insulation layer;

a first metal layer deposited on the insulation layer;

a beam oxide layer deposited on the first metal layer;

a second metal layer deposited on the beam oxide layer; and

an insulation balance layer deposited on the second metal layer, the insulation balance layer comprising a material having a composition and size selected to compensate against the insulation layer with respect to mechanical and thermo-mechanical balance of the beam;

wherein the deposited layers are patterned and etched to define a multilayer structure.

2. The multilayer structure of claim 1 , wherein the first metal layer is patterned to define a structure for use as an actuator electrode, a capacitor electrode for a fixed or tunable capacitor, a switch contact, an inductor coil, or a bond pad.

3. The multilayer structure of claim 1 , wherein the second metal layer is patterned to define a structure for use as an actuator electrode, a capacitor electrode for a fixed or tunable capacitor, a switch contact, an inductor coil, or a bond pad.

4. The multilayer structure of claim 1 , wherein the insulation balance layer comprises a material having the same composition and thickness as the insulation layer.

5. The multilayer structure of claim 1 , further comprising a base metal layer deposited on the substrate, and wherein a capacitor is defined between the base metal layer and the first metal layer.

6. The multilayer structure of claim 1 , further comprising a lid layer deposited over the multilayer structure.