Semiconductor device and manufacturing method

1. A device, comprising:

a semiconductor chip;

an encapsulating material covering the semiconductor chip;

a metal layer over the semiconductor chip and the encapsulating material; and

a voltage generating unit having a recess, the voltage generating unit rigidly attached to at least one of the encapsulating material and the metal layer,

wherein the semiconductor chip and the encapsulating material are arranged in the recess.

2. The device of claim 1 , wherein a face of the semiconductor chip and a face of the encapsulating material define a first plane and the metal layer is arranged on the first plane.

3. The device of claim 1 , wherein the voltage generating unit comprises at least one of a battery, a solar cell and a microreactor.

4. The device of claim 1 , wherein the metal layer is electrically coupled to the voltage generating unit and the semiconductor chip.

5. A method for fabricating the device of claim 1 , comprising:

providing the semiconductor chip;

applying the encapsulating material to the semiconductor chip;

applying the metal layer over the semiconductor chip and the encapsulating material; and

rigidly attaching the voltage generating unit to at least one of the encapsulating material and the metal layer.

6. The method of claim 5 , comprising gluing the voltage generating unit to the encapsulating material.

7. The method of claim 5 , comprising electrically coupling the voltage generating unit to the metal layer by an electrically conductive adhesive.

8. The method of claim 5 , comprising electrically coupling the voltage generating unit to the metal layer by solder material.

9. The device of claim 5 , comprising gluing at least one of a sense unit, an input unit, an output unit and an external contact unit to at least one of the encapsulating material and the metal layer.

10. The method of claim 5 , comprising applying wherein the encapsulating material by molding or laminating.

11. A method for fabricating the device of claim 1 , comprising:

providing the semiconductor chip and the voltage generating unit;

applying the encapsulating material to the semiconductor chip and the voltage generating unit; and

applying the metal layer over at least two of the semiconductor chip, the encapsulating material and the voltage generating unit.

12. The method of claim 11 , comprising:

placing the semiconductor chip and the voltage generating unit on a carrier before the application of the encapsulating material; and

removing the carrier from the semiconductor chip and the voltage generating unit after the application of the encapsulating material.

13. The method of claim 12 , comprising applying the metal layer after the carrier is removed.

14. The method of claim 11 , comprising gluing a display unit to the encapsulating material.

15. The device of claim 1 , wherein the metal layer directly contacts the semiconductor chip and the encapsulating material.

16. A device package, comprising:

a radio-frequency chip and a baseband chip;

an encapsulating material covering the radio-frequency chip and the baseband chip;

a metal layer over the radio-frequency chip, the baseband chip and the encapsulating material; and

a voltage generating unit having a recess, the voltage generating unit rigidly attached to at least one of the encapsulating material and the metal layer,

wherein the radio-frequency chip, the baseband chip, and the encapsulating material are arranged in the recess.

17. The device of claim 16 , further comprising:

a display unit rigidly attached to at least one of the encapsulating material and the metal layer.

18. The device of claim 17 ,wherein at least one of the voltage generating unit and the display unit is glued to the encapsulating material.

19. The device of claim 16 , wherein the metal layer directly contacts the radio-frequency chip, the baseband chip and the encapsulating material.