Semiconductor device and method of manufacturing the same
View Patent ↗Aiming at providing a semiconductor device advanced in performance of transistors, and improved in reliability, a semiconductor device of the present invention has a semiconductor element, a frame component provided over the semiconductor element, while forming a cavity therein, and a molding resin layer covering around the frame component, wherein the frame component is composed of a plurality of resin films (a first resin film and a second resin film) containing the same resin, and the cavity allows the active region of the semiconductor element to expose therein.
1. A semiconductor device comprising:
a semiconductor element;
a frame component provided over said semiconductor element, while forming a cavity therein; and
a molding resin layer covering around said frame component;
wherein said frame component is composed of a plurality of resin films containing the same resin, and
said cavity allows the active region of said semiconductor element to expose therein.
2. The semiconductor device as claimed in claim 1 ,
wherein said frame component contains a first resin film risen up so as to surround said active region of said semiconductor element; and
a second resin film provided as a lid component tightly closing the space, surrounded by said first resin film, from the top.
3. The semiconductor device as claimed in claim 1 ,
wherein said first and second resin films are composed of a resin curable by heat and light.
4. The semiconductor device as claimed in claim 1 ,
wherein said resin films contain an epoxy resin.