Semiconductor wafer with an epitaxially deposited layer, and process for producing the semiconductor wafer
View Patent ↗A semiconductor wafer is formed of a substrate wafer of single crystal silicon doped with dopant atoms of the n type or p type, with a front surface and a back surface, contains a layer deposited epitaxially on the front surface of the substrate wafer. The substrate wafer additionally includes an n ++ or p ++ doped layer, which extends from the front surface of the substrate wafer into the substrate wafer and has a defined thickness. The semiconductor wafer is produced by a process in which dopant atoms of the n type or p type are introduced into the substrate wafer through the front surface of the substrate wafer, the dopant concentration in a layer which extends from the front surface of the substrate wafer into the substrate wafer being increased from the level n + or p + to the level n ++ or p ++ , and an epitaxial layer is then deposited on this layer.
1. A process for producing an epitaxially coated semiconductor wafer with low resistivity below the epitaxial layer, comprising
providing a substrate wafer of single crystal silicon doped with dopant atoms of the n type or p type and having a front surface and a back surface,
forming a layer on the front surface of the substrate wafer by introducing additional dopant atoms of the n type or p type into the substrate wafer through the whole of the front surface of the substrate wafer, the layer extending from the front surface of the substrate wafer into the substrate wafer and having a thickness of at least 20 μm, the dopant concentration in the layer being increased by the additional dopant atoms introduced from the level n + to the level n ++ when the substrate wafer is an n + doped wafer, or from the level p + to the level p ++ when the substrate wafer is a p + doped wafer;
depositing an epitaxial layer on the front surface of the substrate wafer; and removing material from the back surface of the substrate wafer until the thickness of the substrate wafer is less than 120 μm or until the dopant level of the substrate wafer is exclusively n ++ or p ++ .
2. The process of claim 1 , wherein the dopants which raise the dopant level from n + to n ++ or from p + to p ++ are introduced into the substrate wafer by diffusion.
3. The process of claim 1 , wherein the dopants which raise the dopant level from n + to n ++ or from p + to p ++ are introduced into the substrate wafer by implantation.
4. The process of claim 1 , wherein the back surface of the substrate wafer is ground.
5. The process of claim 1 , wherein the thickness of the substrate wafer is reduced following a process for fabricating electronic components.
6. The process of claim 5 , wherein the back surface of the substrate wafer is ground.
7. The process of claim 1 , further comprising fabricating a plurality of electronic components on the wafer, and removing from the back surface of the wafer sufficient thickness to remove substantially all of the n + or p + doped single crystal silicon.
8. The process of claim 1 , wherein the step of forming a layer takes place on a surface of the wafer which is devoid of fabricated electronic components.
9. The process of claim 1 , wherein the layer formed in the step of forming a layer is doped with phosphorus and has a resistivity of less than 1 mΩcm.
10. The process of claim 1 , wherein the layer formed in the step of forming a layer is doped with arsenic and has a resistivity of less than 2 mΩcm.
11. The process of claim 1 , wherein the layer formed in the step of forming a layer is doped with antimony and has a resistivity of less than 10 mΩcm.
12. The process of claim 1 , wherein the layer formed in the step of forming a layer is doped with boron and has a resistivity of less than 1 mΩcm.
13. The process of claim 1 wherein the thickness of the layer formed in the step of forming a layer is at least 30 μm.
14. The process of claim 4 , wherein the thickness of the wafer after the wafer is ground is less than 120 μm.
15. The process of claim 4 , wherein the thickness of the wafer after the wafer is ground is less than 80 μm.
16. The process of claim 6 , wherein the thickness of the wafer after the wafer is ground is less than 120 μm.
17. The process of claim 6 , wherein the thickness of the wafer after the wafer is ground is less than 80 μm.